ACS722LLCTR-20AB-T Allegro MicroSystems SENSOR CURRENT HALL 20A AC/DC

label:
2024/01/19 429



• Patented integrated digital temperature compensation circuitry allows for near closed loop accuracy over temperature in an open loop sensor  
• UL60950-1 (ed. 2) certified
   □ Dielectric Strength Voltage = 2.4 kVrms
   □ Basic Isolation Working Voltage = 420 Vpk/297 Vrms
• Industry-leading noise performance with greatly improved bandwidth through proprietary amplifier and filter design techniques
• Pin-selectable band width: 80 kHz for high bandwidth applications or 20 kHz for low noise performance
• 0.65 mΩ primary conductor resistance for low power loss and high inrush current withstand capability
• Small footprint, low-profile SOIC8 package suitable for space-constrained applications
• Integrated shield virtually eliminates capacitive coupling from current conductor to die, greatly suppressing output noise due to high dv/dt transients
• 3 to 3.6 V, single supply operation



CATALOG
ACS722LLCTR-20AB-T COUNTRY OF ORIGIN
ACS722LLCTR-20AB-T PARAMETRIC INFO
ACS722LLCTR-20AB-T PACKAGE INFO
ACS722LLCTR-20AB-T MANUFACTURING INFO
ACS722LLCTR-20AB-T PACKAGING INFO
ACS722LLCTR-20AB-T FUNCTIONAL BLOCK DIAGRAM  



COUNTRY OF ORIGIN
Philippines



PARAMETRIC INFO
Type Open Loop
Sensing Current Type AC|DC
Accuracy (%) ±3
Typical Response Time (us) 22.5
Sensitivity (mV/A) 66
Operating Frequency (kHz) 80
Maximum Output Voltage (V) 25
Maximum Isolation Voltage 2400Vrms
Primary Current Measuring Range (A) ±20
Measuring Principle Hall Effect
Minimum Operating Supply Voltage (V) 3
Process Technology BiCMOS
Typical Operating Supply Voltage (V) 3.3
Maximum Operating Supply Voltage (V) 3.6
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 150
Module/IC Classification IC
Maximum Storage Temperature (°C) 165
Minimum Storage Temperature (°C) -65
 


PACKAGE INFO
Supplier Package SOIC N
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 4.9
Package Width (mm) 3.9
Package Height (mm) 1.5(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 1.75(Max)
Mounting Surface Mount
Package Material Plastic
Package Description Small Outline IC Narrow Body
Package Family Name SO
Jedec MS-012AA
Package Outline Link to Datasheet
 


MANUFACTURING INFO
MSL 2
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 20 to 40
Number of Reflow Cycle 3
Standard J-STD-020C
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy
 


PACKAGING INFO
Packaging Tape and Reel
Quantity Of Packaging 3000
 


FUNCTIONAL BLOCK DIAGRAM

Продукт RFQ