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• Patented integrated digital temperature compensation
circuitry allows for near closed loop accuracy over
temperature in an open loop sensor |
• UL60950-1 (ed. 2) certified
□ Dielectric Strength Voltage = 2.4 kVrms
□ Basic Isolation Working Voltage = 420 Vpk/297
Vrms |
• Industry-leading noise performance with greatly
improved bandwidth through proprietary amplifier and
filter design techniques |
• Pin-selectable band width: 80 kHz for high bandwidth
applications or 20 kHz for low noise performance |
• 0.65 mΩ primary conductor resistance for low power
loss and high inrush current withstand capability |
• Small footprint, low-profile SOIC8 package suitable for
space-constrained applications |
• Integrated shield virtually eliminates capacitive coupling
from current conductor to die, greatly suppressing output
noise due to high dv/dt transients |
• 3 to 3.6 V, single supply operation |
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CATALOG |
ACS722LLCTR-20AB-T COUNTRY OF ORIGIN |
ACS722LLCTR-20AB-T PARAMETRIC INFO |
ACS722LLCTR-20AB-T PACKAGE INFO |
ACS722LLCTR-20AB-T MANUFACTURING INFO |
ACS722LLCTR-20AB-T PACKAGING INFO |
ACS722LLCTR-20AB-T FUNCTIONAL BLOCK DIAGRAM
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COUNTRY OF ORIGIN |
Philippines |
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PARAMETRIC INFO |
Type |
Open Loop |
Sensing Current Type |
AC|DC |
Accuracy (%) |
±3 |
Typical Response Time (us) |
22.5 |
Sensitivity (mV/A) |
66 |
Operating Frequency (kHz) |
80 |
Maximum Output Voltage (V) |
25 |
Maximum Isolation Voltage |
2400Vrms |
Primary Current Measuring Range (A) |
±20 |
Measuring Principle |
Hall Effect |
Minimum Operating Supply Voltage (V) |
3 |
Process Technology |
BiCMOS |
Typical Operating Supply Voltage (V) |
3.3 |
Maximum Operating Supply Voltage (V) |
3.6 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
150 |
Module/IC Classification |
IC |
Maximum Storage Temperature (°C) |
165 |
Minimum Storage Temperature (°C) |
-65 |
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PACKAGE INFO |
Supplier Package |
SOIC N |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
8 |
Lead Shape |
Gull-wing |
PCB |
8 |
Tab |
N/R |
Pin Pitch (mm) |
1.27 |
Package Length (mm) |
4.9 |
Package Width (mm) |
3.9 |
Package Height (mm) |
1.5(Max) |
Package Diameter (mm) |
N/R |
Seated Plane Height (mm) |
1.75(Max) |
Mounting |
Surface Mount |
Package Material |
Plastic |
Package Description |
Small Outline IC Narrow Body |
Package Family Name |
SO |
Jedec |
MS-012AA |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO |
MSL |
2 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
20 to 40 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020C |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Wave Temp. Source |
Link to Datasheet |
Lead Finish(Plating) |
Matte Sn annealed |
Under Plating Material |
N/A |
Terminal Base Material |
Cu Alloy |
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PACKAGING INFO |
Packaging |
Tape and Reel |
Quantity Of Packaging |
3000 |
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FUNCTIONAL BLOCK DIAGRAM
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