ACS723LLCTR-05AB-T Allegro MicroSystems SENSOR CURRENT HALL 5A AC/DC

label:
2024/01/23 326



• Patented integrated digital temperature compensation circuitry allows for near closed loop accuracy over temperature in an open loop sensor
• UL60950-1 (ed. 2) certified □ Dielectric Strength Voltage = 2.4 kVrms □ Basic Isolation Working Voltage = 420 Vpk/ 297 Vrms
• Industry-leading noise performance with greatly improved bandwidth through proprietary amplifier and filter design techniques
• Pin-selectable bandwidth: 80 kHz for high bandwidth applications or 20 kHz for low-noise performance
• 0.65 mΩ primary conductor resistance for low power loss and high inrush current withstand capability
• Small footprint, low-profile SOIC8 package suitable for space-constrained applications
• Integrated shield virtually eliminates capacitive coupling from current conductor to die, greatly suppressing output noise due to high dv/dt transients
• 4.5 to 5.5 V, single supply operation
• Output voltage proportional to AC or DC current
• Factory-trimmed sensitivity and quiescent output voltage for improved accuracy


CATALOG
ACS723LLCTR-05AB-T COUNTRY OF ORIGIN
ACS723LLCTR-05AB-T PARAMETRIC INFO
ACS723LLCTR-05AB-T PACKAGE INFO
ACS723LLCTR-05AB-T MANUFACTURING INFO
ACS723LLCTR-05AB-T PACKAGING INFO
ACS723LLCTR-05AB-T ECAD MODELS


COUNTRY OF ORIGIN
Thailand
Philippines


PARAMETRIC INFO
Type Open Loop
Typical RMS Primary Current (A) ±5
Sensing Current Type AC|DC
Accuracy (%) ±3
Typical Response Time (us) 22.5
Sensitivity (mV/A) 400
Operating Frequency (kHz) 80
Maximum Output Voltage (V) 25
Minimum Operating Supply Voltage (V) 4.5
Typical Operating Supply Voltage (V) 5
Maximum Operating Supply Voltage (V) 5.5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 150
Module/IC Classification IC
Maximum Storage Temperature (°C) 165
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package SOIC N
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 4.9
Package Width (mm) 3.9
Package Height (mm) 1.5(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 1.75(Max)
Mounting Surface Mount
Package Material Plastic
Package Description Small Outline IC Narrow Body
Package Family Name SO
Jedec MS-012AA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 2
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 20 to 40
Number of Reflow Cycle 3
Standard J-STD-020C
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Tape and Reel
Quantity Of Packaging 3000


ECAD MODELS


Продукт RFQ