ACS758LCB-050B-PFF-T Allegro MicroSystems SENSOR CURRENT HALL 50A AC/DC

label:
2023/11/15 348


• Industry-leading noise performance through proprietary amplifier and filter design techniques
• Integrated shield greatly reduces capacitive coupling from current conductor to die due to high dV/dt signals, and prevents offset drift in high-side, high-voltage applications  
• Total output error improvement through gain and offset trim over temperature
• Small package size, with easy mounting capability
• Monolithic Hall IC for high reliability
• Ultralow power loss:100 µΩ internal conductor resistance
• Galvanic isolation allows use in economical, high-side current sensing in high-voltage systems
• AEC-Q100 qualified
• 3.0 to 5.5 V, single supply operation
• 120 kHz typical bandwidth
• 3 µs output rise time in response to step input current
• Output voltage proportional to AC or DC currents  
• Factory-trimmed for accuracy
• Factory-trimmed for accuracy
• Nearly zero magnetic hysteresis


CATALOG
ACS758LCB-050B-PFF-T COUNTRY OF ORIGIN
ACS758LCB-050B-PFF-T PARAMETRIC INFO
ACS758LCB-050B-PFF-T PACKAGE INFO
ACS758LCB-050B-PFF-T MANUFACTURING INFO
ACS758LCB-050B-PFF-T PACKAGING INFO
ACS758LCB-050B-PFF-T ECAD MODELS
ACS758LCB-050B-PFF-T FUNCTIONAL BLOCK DIAGRAM  


COUNTRY OF ORIGIN
Philippines
Taiwan (Province of China)


PARAMETRIC INFO
Type Open Loop
Typical RMS Primary Current (A) ±50
Sensing Current Type AC|DC
Accuracy (%) 2
Typical Response Time (us) 4
Sensitivity (mV/A) 40
Operating Frequency (kHz) 120
Maximum Output Voltage (V) 28
Minimum Operating Supply Voltage (V) 3
Typical Operating Supply Voltage (V) 5
Maximum Operating Supply Voltage (V) 5.5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 150
Module/IC Classification IC
Supplier Temperature Grade Automotive
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65
 
PACKAGE INFO
Supplier Package Case CB-PFF
Basic Package Type Through Hole
Pin Count 5
Lead Shape Through Hole
PCB 5
Tab N/R
Pin Pitch (mm) 1.9
Package Length (mm) 10
Package Width (mm) 13
Package Height (mm) 7
Package Diameter (mm) N/R
Seated Plane Height (mm) N/A
Mounting Through Hole
Package Material Plastic
Package Description N/A
Package Family Name Case CB-PFF
Jedec N/A
 
MANUFACTURING INFO
MSL N/R
Maximum Reflow Temperature (°C) N/R
Reflow Solder Time (Sec) N/R
Maximum Wave Temperature (°C) 245 to 270
Wave Solder Time (Sec) 10
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy
 
PACKAGING INFO
Packaging Tube
 
ECAD MODELS


FUNCTIONAL BLOCK DIAGRAM


Продукт RFQ