AD210BN Analog Devices IC OPAMP ISOLATION 20KHZ 12DIP

label:
2023/12/12 246


• High CMV Isolation: 2500 V rms Continuous 3500 V Peak Continuous
• Small Size: 1.00" 3 2.10" 3 0.350"
• Three-Port Isolation: Input, Output, and Power
• Low Nonlinearity: 60.012% max
• Wide Bandwidth: 20 kHz Full-Power (–3 dB)
• Low Gain Drift: 625 ppm/8C max
• High CMR: 120 dB (G = 100 V/V)  
• Isolated Power: 615 V @ 65 mA  
• Uncommitted Input Amplifier


CATALOG
AD210BN COUNTRY OF ORIGIN
AD210BN PARAMETRIC INFO
AD210BN PACKAGE INFO
AD210BN MANUFACTURING INFO
AD210BN PACKAGING INFO
AD210BN ECAD MODELS
AD210BN FUNCTIONAL BLOCK DIAGRAM
AD210BN APPLICATIONS

 
COUNTRY OF ORIGIN
Philippines


PARAMETRIC INFO
Type Isolation Amplifier
Number of Elements per Chip 2
Number of Channels per Chip 3
Maximum Input Bias Current (uA) 0.00003(Typ)@15V
Minimum CMRR (dB) 120(Typ)
Maximum Quiescent Current (mA) 50(Typ)@15V
Minimum CMRR Range (dB) 120 to 130
Minimum DC Continuous Isolation Voltage (V) 3500(Typ)
Maximum Input Resistance (MOhm) 1000000(Typ)@15V
Maximum Voltage Gain Range (dB) 35 to 50
Maximum Voltage Gain (dB) 40
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Power Supply Type Single
Maximum Supply Voltage Range (V) 15 to 18
Minimum Single Supply Voltage (V) 13.5
Typical Single Supply Voltage (V) 15
Maximum Single Supply Voltage (V) 16.5
Maximum Operating Supply Voltage (V) 16.5
Maximum Supply Current (mA) 80(Typ)@15V
 
PACKAGE INFO
Supplier Package PDIP
Basic Package Type Through Hole
Pin Count 12
Lead Shape Through Hole
PCB 12
Tab N/R
Package Length (mm) 53.34(Max)
Package Width (mm) 25.4(Max)
Package Height (mm) 8.9(Max)
Package Diameter (mm) N/R
Mounting Through Hole
Package Material Plastic
Package Description Plastic Dual In Line Package
Package Family Name DIP
Package Outline Link to Datasheet
 
MANUFACTURING INFO
MSL N/R
Maximum Reflow Temperature (°C) N/R
Reflow Solder Time (Sec) N/R
Maximum Wave Temperature (°C) N/A
Wave Solder Time (Sec) N/A
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) SnPb
Under Plating Material N/A
Terminal Base Material N/A
 
PACKAGING INFO
Packaging Tube
Quantity Of Packaging 9
Packaging Document Link to Datasheet
 
ECAD MODELS

 
FUNCTIONAL BLOCK DIAGRAM


APPLICATIONS
• Multichannel Data Acquisition
• High Voltage Instrumentation Amplifier
• Current Shunt Measurements
• Process Signal Isolation

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