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• Single 16-bit DAC, 1 LSB INL
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• Power-on reset to midscale
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• Guaranteed monotonic by design
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• 3 power-down functions
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• Low power serial interface with Schmitt-triggered inputs
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• 10-lead MSOP, low power
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• Fast settling time of 1 µs maximum (AD5063-1 model)
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• 2.7 V to 5.5 V power supply
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• Low glitch on power-up
|
• Unbuffered voltage capable of driving 60 kΩ load
|
• SYNC interrupt facility
|
|
| CATALOG |
AD5063BRMZ-REEL7 COUNTRY OF ORIGIN
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AD5063BRMZ-REEL7 PARAMETRIC INFO
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AD5063BRMZ-REEL7 PACKAGE INFO
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AD5063BRMZ-REEL7 MANUFACTURING INFO
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AD5063BRMZ-REEL7 PACKAGING INFO
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AD5063BRMZ-REEL7 ECAD MODELS
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AD5063BRMZ-REEL7 FUNCTIONAL BLOCK DIAGRAM
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AD5063BRMZ-REEL7 APPLICATIONS
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COUNTRY OF ORIGIN
|
Philippines
|
|
PARAMETRIC INFO
|
| Architecture |
R-2R |
| Resolution |
16bit |
| Number of DAC Channels |
1 |
| Number of Outputs per Chip |
1 |
| Conversion Rate |
333ksps |
| Converter Type |
General Purpose |
| Output Type |
Voltage |
| Voltage Reference |
External |
| Maximum Settling Time (us) |
4(Typ) |
| Digital Interface Type |
Serial (3-Wire, SPI, QSPI, Microwire) |
| Output Polarity |
Unipolar|Bipolar |
| Integral Nonlinearity Error |
±1LSB |
| Full Scale Error |
±0.8mV |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Power Supply Type |
Single |
| Minimum Single Supply Voltage (V) |
2.7 |
| Typical Single Supply Voltage (V) |
3.3|5 |
| Maximum Single Supply Voltage (V) |
5.5 |
| Digital Supply Support |
No |
| Maximum Power Dissipation (mW) |
3.85 |
|
|
PACKAGE INFO
|
| Supplier Package |
MSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
10 |
| Lead Shape |
Gull-wing |
| PCB |
10 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
3 |
| Package Width (mm) |
3 |
| Package Height (mm) |
0.85 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3 |
| Package Overall Width (mm) |
4.9 |
| Package Overall Height (mm) |
1.1(Max) |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Micro Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-187BA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging Suffix |
REEL7 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1000 |
| Reel Diameter (in) |
7 |
| Packaging Document |
Link to Datasheet |
|
|
| ECAD MODELS |
|
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FUNCTIONAL BLOCK DIAGRAM
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APPLICATIONS
|
• Process control
|
• Data acquisition systems
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• Portable battery-powered instruments
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• Digital gain and offset adjustment
|
• Programmable voltage and current sources
|
• Programmable attenuators
|
|
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