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• 256 position
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• 10 kΩ, 50 kΩ, 100 kΩ
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• +20 V to +30 V single-supply operation
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• ±10 V to ±15 V dual-supply operation
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• 3-wire SPI®-compatible serial interface
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• Low temperature coefficient 35 ppm/°C typical
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• THD 0.006% typical
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• Midscale preset
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• Compact MSOP-10 package
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• Automotive temperature range: −40°C to +125°C
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• iCMOS™1 process technology
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| CATALOG |
AD5290YRMZ10-R7 COUNTRY OF ORIGIN
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AD5290YRMZ10-R7 PARAMETRIC INFO
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AD5290YRMZ10-R7 PACKAGE INFO
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AD5290YRMZ10-R7 MANUFACTURING INFO
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AD5290YRMZ10-R7 PACKAGING INFO
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AD5290YRMZ10-R7 ECAD MODELS
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AD5290YRMZ10-R7 FUNCTIONAL BLOCK DIAGRAM
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AD5290YRMZ10-R7 APPLICATIONS
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COUNTRY OF ORIGIN
|
Malaysia
|
Philippines
|
|
PARAMETRIC INFO
|
| Resistance Value (KOhm) |
10 |
| Number of Positions |
256 |
| Number of Pot per Package |
1 |
| Memory Type |
Volatile |
| Taper Type |
Linear |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Supplier Temperature Grade |
Automotive |
| Process Technology |
iCMOS™ |
| Power Supply Type |
Single|Dual |
| Maximum Dual Supply Voltage (V) |
±15 |
| Maximum Single Supply Voltage (V) |
30 |
| Maximum Supply Current (mA) |
0.015(Typ) |
| Minimum Dual Supply Voltage (V) |
±10 |
| Minimum Single Supply Voltage (V) |
20 |
| Typical Dual Supply Voltage (V) |
±5|±9|±12 |
| Typical Single Supply Voltage (V) |
15 |
| Control Interface |
Serial (3-Wire, SPI) |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
|
|
PACKAGE INFO
|
| Supplier Package |
MSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
10 |
| Lead Shape |
Gull-wing |
| PCB |
10 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
3 |
| Package Width (mm) |
3 |
| Package Height (mm) |
0.85 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3 |
| Package Overall Width (mm) |
4.9 |
| Package Overall Height (mm) |
1.1(Max) |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Micro Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-187BA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R7 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1000 |
| Reel Diameter (in) |
7 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
| Tape Material |
Plastic |
| Tape Type |
Embossed |
|
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| ECAD MODELS |
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FUNCTIONAL BLOCK DIAGRAM
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APPLICATIONS
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• High voltage DAC
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• Programmable power supply
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• Programmable gain and offset adjustment
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| • Programmable filters and delays |
| • Actuator control |
| • Audio volume control |
| • Mechanical potentiometer replacement |
| |
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