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|
• 16-bit resolution AD5543
|
• 14-bit resolution AD5553
|
• ±1 LSB DNL
|
• ±1 LSB INL
|
• Low noise: 12 nV/√Hz
|
• Low power: IDD = 10 µA
|
• 0.5 µs settling time
|
• 4-quadrant multiplying reference input
|
• 2 mA full-scale current ± 20%, with VREF = 10 V
|
• Built-in RFB facilitates voltage conversion
|
• 3-wire interface
|
• Ultracompact 8-lead MSOP and 8-lead SOIC packages
|
|
| CATALOG |
| AD5543BRMZ-REEL7 COUNTRY OF ORIGIN |
AD5543BRMZ-REEL7 PARAMETRIC INFO
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AD5543BRMZ-REEL7 PACKAGE INFO
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AD5543BRMZ-REEL7 MANUFACTURING INFO
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AD5543BRMZ-REEL7 PACKAGING INFO
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AD5543BRMZ-REEL7 ECAD MODELS
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AD5543BRMZ-REEL7 FUNCTIONAL BLOCK DIAGRAM
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AD5543BRMZ-REEL7 APPLICATIONS
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|
COUNTRY OF ORIGIN
|
| Malaysia |
Taiwan (Province of China)
|
Ireland
|
|
PARAMETRIC INFO
|
| Architecture |
R-2R|Current Steering |
| Resolution |
16bit |
| Number of DAC Channels |
1 |
| Number of Outputs per Chip |
1 |
| Converter Type |
General Purpose |
| Input Code |
Binary |
| Typical Settling Time (us) |
0.5 |
| Maximum Analog Output Voltage |
8.3V |
| Minimum Analog Output Voltage |
-0.3V |
| Multiplying Function |
Yes |
| Output Type |
Current |
| Voltage Reference |
External |
| Digital Interface Type |
Serial (3-Wire) |
| Output Polarity |
Unipolar |
| Integral Nonlinearity Error |
±2LSB |
| Full Scale Error |
±4mV |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Power Supply Type |
Single |
| Minimum Single Supply Voltage (V) |
4.5 |
| Typical Single Supply Voltage (V) |
5 |
| Maximum Single Supply Voltage (V) |
5.5 |
| Digital Supply Support |
No |
| Maximum Power Dissipation (mW) |
0.055 |
|
|
PACKAGE INFO
|
| Supplier Package |
MSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
3 |
| Package Width (mm) |
3 |
| Package Height (mm) |
0.85 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3 |
| Package Overall Width (mm) |
4.9 |
| Package Overall Height (mm) |
1.1(Max) |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Micro Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-187AA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
REEL7 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1000 |
| Reel Diameter (in) |
7 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
| Tape Material |
Plastic |
| Tape Type |
Embossed |
|
|
ECAD MODELS
|
|
|
FUNCTIONAL BLOCK DIAGRAM
|
|
|
| APPLICATION |
• Automatic test equipment
|
• Instrumentation
|
• Digitally controlled calibration
|
• Industrial control programmable logic controllers
|
| |
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