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• Low power, single nanoDACs AD5660: 16 bits AD5640: 14 bits AD5620: 12 bits
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• 12-bit accuracy guaranteed
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• On-chip, 1.25 V/2.5 V, 5 ppm/°C reference
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• Tiny 8-lead SOT-23, MSOP, and LFCSP packages
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• Power-down to 480 nA @ 5 V, 200 nA @ 3 V |
• 3 V/5 V single power supply |
• Guaranteed 16-bit monotonic by design |
• Power-on reset to zero/midscale |
• 3 power-down functions |
• Serial interface with Schmitt-triggered inputs |
• Rail-to-rail operation |
• SYNC interrupt facility |
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CATALOG |
AD5640CRMZ-1 COUNTRY OF ORIGIN |
AD5640CRMZ-1 PARAMETRIC INFO
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AD5640CRMZ-1 PACKAGE INFO
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AD5640CRMZ-1 MANUFACTURING INFO
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AD5640CRMZ-1 PACKAGING INFO
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AD5640CRMZ-1 EACD MODELS
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AD5640CRMZ-1 FUNCTIONAL BLOCK DIAGRAM |
AD5640CRMZ-1 APPLICATIONS |
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COUNTRY OF ORIGIN |
Taiwan (Province of China) |
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PARAMETRIC INFO
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Architecture |
Resistor-String |
Resolution |
14bit |
Number of DAC Channels |
1 |
Number of Outputs per Chip |
1 |
Converter Type |
General Purpose |
Output Type |
Voltage |
Voltage Reference |
Internal |
Maximum Settling Time (us) |
10 |
Digital Interface Type |
Serial (3-Wire, SPI, QSPI, Microwire) |
Output Polarity |
Unipolar |
Integral Nonlinearity Error |
±4LSB |
Full Scale Error |
±0.85%FSR |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
105 |
Supplier Temperature Grade |
Industrial |
Minimum Storage Temperature (°C) |
-65 |
Maximum Storage Temperature (°C) |
150 |
Power Supply Type |
Single |
Minimum Single Supply Voltage (V) |
2.7 |
Typical Single Supply Voltage (V) |
3 |
Maximum Single Supply Voltage (V) |
3.3 |
Digital Supply Support |
No |
Maximum Power Dissipation (mW) |
5(Typ) |
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PACKAGE INFO
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Supplier Package |
MSOP |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
8 |
Lead Shape |
Gull-wing |
PCB |
8 |
Tab |
N/R |
Pin Pitch (mm) |
0.65 |
Package Length (mm) |
3 |
Package Width (mm) |
3 |
Package Height (mm) |
0.85 |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
3 |
Package Overall Width (mm) |
4.9 |
Package Overall Height (mm) |
1.1(Max) |
Seated Plane Height (mm) |
1.1(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Micro Small Outline Package |
Package Family Name |
SO |
Jedec |
MO-187AA |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Matte Sn annealed |
Under Plating Material |
N/A |
Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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Packaging |
Tube |
Quantity Of Packaging |
50 |
Packaging Document |
Link to Datasheet |
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ECAD MODELS
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FUNCTIONAL BLOCK DIAGRAM |
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APPLICATIONS |
• Process control |
• Data acquisition systems |
• Portable battery-powered instruments |
• Digital gain and offset adjustment |
• Programmable voltage and current sources |
• Programmable attenuators |
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