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• Low power, single nanoDACs AD5660: 16 bits AD5640: 14 bits AD5620: 12 bits
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• 12-bit accuracy guaranteed
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• On-chip, 1.25 V/2.5 V, 5 ppm/°C reference
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| • Tiny 8-lead SOT-23, MSOP, and LFCSP packages
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| • Power-down to 480 nA @ 5 V, 200 nA @ 3 V |
| • 3 V/5 V single power supply |
| • Guaranteed 16-bit monotonic by design |
| • Power-on reset to zero/midscale |
| • 3 power-down functions |
| • Serial interface with Schmitt-triggered inputs |
| • Rail-to-rail operation |
| • SYNC interrupt facility |
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| CATALOG |
| AD5640CRMZ-1 COUNTRY OF ORIGIN |
AD5640CRMZ-1 PARAMETRIC INFO
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AD5640CRMZ-1 PACKAGE INFO
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AD5640CRMZ-1 MANUFACTURING INFO
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AD5640CRMZ-1 PACKAGING INFO
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AD5640CRMZ-1 EACD MODELS
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| AD5640CRMZ-1 FUNCTIONAL BLOCK DIAGRAM |
| AD5640CRMZ-1 APPLICATIONS |
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| COUNTRY OF ORIGIN |
| Taiwan (Province of China) |
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PARAMETRIC INFO
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| Architecture |
Resistor-String |
| Resolution |
14bit |
| Number of DAC Channels |
1 |
| Number of Outputs per Chip |
1 |
| Converter Type |
General Purpose |
| Output Type |
Voltage |
| Voltage Reference |
Internal |
| Maximum Settling Time (us) |
10 |
| Digital Interface Type |
Serial (3-Wire, SPI, QSPI, Microwire) |
| Output Polarity |
Unipolar |
| Integral Nonlinearity Error |
±4LSB |
| Full Scale Error |
±0.85%FSR |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
105 |
| Supplier Temperature Grade |
Industrial |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Power Supply Type |
Single |
| Minimum Single Supply Voltage (V) |
2.7 |
| Typical Single Supply Voltage (V) |
3 |
| Maximum Single Supply Voltage (V) |
3.3 |
| Digital Supply Support |
No |
| Maximum Power Dissipation (mW) |
5(Typ) |
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|
PACKAGE INFO
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| Supplier Package |
MSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
3 |
| Package Width (mm) |
3 |
| Package Height (mm) |
0.85 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3 |
| Package Overall Width (mm) |
4.9 |
| Package Overall Height (mm) |
1.1(Max) |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Micro Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-187AA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
|
| Packaging |
Tube |
| Quantity Of Packaging |
50 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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| FUNCTIONAL BLOCK DIAGRAM |
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| APPLICATIONS |
| • Process control |
| • Data acquisition systems |
| • Portable battery-powered instruments |
| • Digital gain and offset adjustment |
| • Programmable voltage and current sources |
| • Programmable attenuators |
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