AD5640CRMZ-1 Analog Devices IC DAC 14BIT SPI/SRL 8MSOP

label:
2024/04/17 247



• Low power, single nanoDACs AD5660: 16 bits AD5640: 14 bits AD5620: 12 bits
• 12-bit accuracy guaranteed
• On-chip, 1.25 V/2.5 V, 5 ppm/°C reference
• Tiny 8-lead SOT-23, MSOP, and LFCSP packages
• Power-down to 480 nA @ 5 V, 200 nA @ 3 V
• 3 V/5 V single power supply
• Guaranteed 16-bit monotonic by design
• Power-on reset to zero/midscale
• 3 power-down functions
• Serial interface with Schmitt-triggered inputs
• Rail-to-rail operation
• SYNC interrupt facility
CATALOG
AD5640CRMZ-1 COUNTRY OF ORIGIN
AD5640CRMZ-1 PARAMETRIC INFO
AD5640CRMZ-1 PACKAGE INFO
AD5640CRMZ-1 MANUFACTURING INFO
AD5640CRMZ-1 PACKAGING INFO
AD5640CRMZ-1 EACD MODELS
AD5640CRMZ-1 FUNCTIONAL BLOCK DIAGRAM
AD5640CRMZ-1 APPLICATIONS


COUNTRY OF ORIGIN
Taiwan (Province of China)



PARAMETRIC INFO
Architecture Resistor-String
Resolution 14bit
Number of DAC Channels 1
Number of Outputs per Chip 1
Converter Type General Purpose
Output Type Voltage
Voltage Reference Internal
Maximum Settling Time (us) 10
Digital Interface Type Serial (3-Wire, SPI, QSPI, Microwire)
Output Polarity Unipolar
Integral Nonlinearity Error ±4LSB
Full Scale Error ±0.85%FSR
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 105
Supplier Temperature Grade Industrial
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Power Supply Type Single
Minimum Single Supply Voltage (V) 2.7
Typical Single Supply Voltage (V) 3
Maximum Single Supply Voltage (V) 3.3
Digital Supply Support No
Maximum Power Dissipation (mW) 5(Typ)


PACKAGE INFO
Supplier Package MSOP
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Pin Pitch (mm) 0.65
Package Length (mm) 3
Package Width (mm) 3
Package Height (mm) 0.85
Package Diameter (mm) N/R
Package Overall Length (mm) 3
Package Overall Width (mm) 4.9
Package Overall Height (mm) 1.1(Max)
Seated Plane Height (mm) 1.1(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Micro Small Outline Package
Package Family Name SO
Jedec MO-187AA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Tube
Quantity Of Packaging 50
Packaging Document Link to Datasheet


ECAD MODELS



FUNCTIONAL BLOCK DIAGRAM
APPLICATIONS
• Process control
• Data acquisition systems
• Portable battery-powered instruments  
• Digital gain and offset adjustment
• Programmable voltage and current sources
• Programmable attenuators
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