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| • HART-compliant fully integrated FSK modem |
| • 1200 Hz and 2200 Hz sinusoidal shift frequencies |
| • 115 µA maximum supply current in receive mode |
| • Suitable for intrinsically safe applications |
• Integrated receive band-pass filter
- Minimal external components required |
• Clocking optimized for various system configurations
- Ultralow power crystal oscillator (60 µA maximum)
- External CMOS clock source
- Precision internal oscillator (AD5700-1only) |
| • Buffered HART output—extra drive capability |
| • 8 kV HBM ESD rating |
| • 1.71 V to 5.5 V power supply |
| • 1.71 V to 5.5 V interface |
| • −40°C to +125°C operation |
| • 4 mm × 4 mm LFCSP package |
| • HART physical layer compliant |
| • UART interface |
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| CATALOG |
| AD5700-1BCPZ-RL7 COUNTRY OF ORIGIN |
| AD5700-1BCPZ-RL7 PARAMETRIC INFO |
| AD5700-1BCPZ-RL7 PACKAGE INFO |
| AD5700-1BCPZ-RL7 MANUFACTURING INFO |
| AD5700-1BCPZ-RL7 PACKAGING INFO |
| AD5700-1BCPZ-RL7 ECAD MODELS |
| AD5700-1BCPZ-RL7 FUNCTIONAL BLOCK DIAGRAM |
| AD5700-1BCPZ-RL7 APPLICATIONS |
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| COUNTRY OF ORIGIN |
| Malaysia |
| Korea (Republic of) |
| China |
|
| PARAMETRIC INFO |
| Main Category |
Single Chip |
| Subcategory |
HART Modem |
| Modulation Technique |
FSK |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Supplier Temperature Grade |
Industrial |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
| Power Supply Type |
Analog |
| Typical Operating Supply Voltage (V) |
3.3|5 |
| Minimum Operating Supply Voltage (V) |
2 |
| Maximum Operating Supply Voltage (V) |
5.5 |
|
|
| PACKAGE INFO |
| Supplier Package |
LFCSP EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
24 |
| Lead Shape |
No Lead |
| PCB |
24 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
4 |
| Package Width (mm) |
4 |
| Package Height (mm) |
0.73 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
4 |
| Package Overall Width (mm) |
4 |
| Package Overall Height (mm) |
0.75 |
| Seated Plane Height (mm) |
0.75 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Lead Frame Chip Scale Package, Exposed Pad |
| Package Family Name |
CSP |
| Jedec |
MO-220WGGD-8 |
| Package Outline |
Link to Datasheet |
|
|
| MANUFACTURING INFO |
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ag |
| Terminal Base Material |
N/A |
|
|
| PACKAGING INFO |
| Packaging Suffix |
RL7 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1500 |
| Reel Diameter (in) |
7 |
| Packaging Document |
Link to Datasheet |
|
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| ECAD MODELS |
 |
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| FUNCTIONAL BLOCK DIAGRAM |
 |
|
| APPLICATIONS |
| • Field transmitters |
| • HART multiplexers |
| • PLC and DCS analog I/O modules |
| • HART network connectivity |
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