 |
|
| • Complete, dual, 12-/14-/16-bit digital-to-analog converter (DAC) Operates from single/dual supplies |
• Software programmable output range
• +5 V, +10 V, +10.8 V, ±5 V, ±10 V, ±10.8 V
|
| • INL error: ±16 LSB maximum, DNL error: ±1 LSB maximum
Total unadjusted error (TUE): 0.1% FSR maximum |
| • Settling time: 10 μs typical |
| • Integrated reference buffers |
| • Output control during power-up/brownout |
| • Simultaneous updating via LDAC |
| • Asynchronous CLR to zero scale or midscale |
| • DSP-/microcontroller-compatible serial interface
24-lead TSSOP |
| • Operating temperature range: −40°C to +85°C
iCMOS process technology |
|
| CATALOG |
| AD5722AREZ-REEL7 COUNTRY OF ORIGIN |
| AD5722AREZ-REEL7 PARAMETRIC INFO |
| AD5722AREZ-REEL7 PACKAGE INFO |
| AD5722AREZ-REEL7 MANUFACTURING INFO |
| AD5722AREZ-REEL7 PACKAGING INFO |
| AD5722AREZ-REEL7 ECAD MODELS |
| AD5722AREZ-REEL7 FUNCTIONAL BLOCK DIAGRAM |
| AD5722AREZ-REEL7 APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| Ireland |
| Philippines |
|
| PARAMETRIC INFO |
| Architecture |
Resistor-String |
| Resolution |
12bit |
| Number of DAC Channels |
2 |
| Number of Outputs per Chip |
2 |
| Converter Type |
General Purpose |
| Output Type |
Voltage |
| Voltage Reference |
External |
| Maximum Settling Time (us) |
12 |
| Digital Interface Type |
Serial (3-Wire, SPI, QSPI, Microwire) |
| Output Polarity |
Unipolar|Bipolar |
| Integral Nonlinearity Error |
±1LSB |
| Full Scale Error |
-0.065/0.08%FSR |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Power Supply Type |
Single|Dual |
| Minimum Single Supply Voltage (V) |
4.5 |
| Typical Single Supply Voltage (V) |
5|9|12|15 |
| Maximum Single Supply Voltage (V) |
16.5 |
| Minimum Dual Supply Voltage (V) |
±4.5 |
| Typical Dual Supply Voltage (V) |
±5|±9|±12|±15 |
| Maximum Dual Supply Voltage (V) |
±16.5 |
| Digital Supply Support |
Yes |
| Maximum Power Dissipation (mW) |
190(Typ) |
|
| PACKAGE INFO |
| supplier package |
tssop ep |
| basic package type |
lead-frame smt |
| pin count |
24 |
| lead shape |
gull-wing |
| pcb |
24 |
| tab |
n/r |
| pin pitch (mm) |
0.65 |
| package length (mm) |
7.8 |
| package width (mm) |
4.4 |
| package height (mm) |
1 |
| package diameter (mm) |
n/r |
| seated plane height (mm) |
1.2(max) |
| mounting |
surface mount |
| package material |
plastic |
| package description |
thin shrink small outline package, exposed pad |
| package family name |
sop |
| jedec |
mo-153ad |
| package outline |
link to datasheet |
|
| MANUFACTURING INFO |
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
|
| PACKAGING INFO |
| Packaging Suffix |
REEL7 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1000 |
| Reel Diameter (in) |
7 |
| Packaging Document |
Link to Datasheet |
|
| ECAD MODELS |
 |
|
| FUNCTIONAL BLOCK DIAGRAM |
 |
|
| APPLICATIONS |
| • Industrial automation |
| • Closed-loop servo control, process control |
| • Automotive test and measurement
|
| • Programmable logic controllers |
|
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