AD603AQ Analog Devices IC OPAMP VGA 90MHZ 8CDIP

label:
2023/11/6 242


• Linear-in-dB gain control
• Pin-programmable gain ranges
   −11 dB to +31 dB with 90 MHz bandwidth
   - 9 dB to 51 dB with 9 MHz bandwidth  
• Any intermediate range, for example −1 dB to +41 dB
   - with 30 MHz bandwidth  
• Bandwidth independent of variable gain
• 1.3 nV/√Hz input noise spectral density
• ±0.5 dB typical gain accuracy  


CATALOG
AD603AQ COUNTRY OF ORIGIN
AD603AQ PARAMETRIC INFO
AD603AQ PACKAGE INFO
AD603AQ MANUFACTURING INFO
AD603AQ PACKAGING INFO
AD603AQ ECAD MODELS
AD603AQ FUNCTIONAL BLOCK DIAGRAM  
AD603AQ APPLICATIONS


COUNTRY OF ORIGIN
Philippines
United States of America


PARAMETRIC INFO
Type Variable Gain Amplifier
Number of Elements per Chip 1
Number of Channels per Chip 1
Maximum Input Bias Current (uA) 0.25@±5V
Maximum Quiescent Current (mA) 17@±5V
Maximum Input Resistance (MOhm) 0.000103@±5V
Maximum Voltage Gain Range (dB) <35
Maximum Voltage Gain (dB) 31.3
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Power Supply Type Dual
Maximum Supply Voltage Range (V) 10 to 15
Minimum Dual Supply Voltage (V) ±4.75
Typical Dual Supply Voltage (V) ±5
Maximum Dual Supply Voltage (V) ±6.3
Maximum Operating Supply Voltage (V) ±6.3
Maximum Power Dissipation (mW) 400
 
PACKAGE INFO
Supplier Package CDIP
Basic Package Type Through Hole
Pin Count 8
Lead Shape Through Hole
PCB 8
Tab N/R
Pin Pitch (mm) 2.54
Package Length (mm) 10.29(Max)
Package Width (mm) 7.87(Max)
Package Height (mm) 3.56(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 5.08(Max)
Mounting Through Hole
Package Material Ceramic
Package Description Ceramic Dual In Line Package
Package Family Name DIP
Jedec N/A
 
MANUFACTURING INFO
MSL N/R
Maximum Reflow Temperature (°C) N/R
Reflow Solder Time (Sec) N/R
Maximum Wave Temperature (°C) 300
Wave Solder Time (Sec) 60
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) SnPb
Under Plating Material Ag
Terminal Base Material FeNi Alloy
 
PACKAGING INFO
Packaging Tube
Quantity Of Packaging 48
Packaging Document Link to Datasheet
 
ECAD MODELS


FUNCTIONAL BLOCK DIAGRAM  

 
APPLICATIONS
• RF/IF AGC amplifiers
• Video gain controls
• A/D range extensions  
• Signal measurements


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