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• Easy to use
- Gain set with one external resistor
-(Gain range 1 to 10,000)
- Wide power supply range (±2.3 V to ±18 V)
- Higher performance than 3 op amp IA designs
- Available in 8-lead DIP and SOIC packaging
- Low power, 1.3 mA max supply current |
• Excellent dc performance (B grade)
- 50 μV max, input offset voltage
- 0.6 μV/°C max, input offset drift
- 1.0 nA max, input bias current
- 100 dB min common-mode rejection ratio (G = 10) |
• Low noise
- 9 nV/√Hz @ 1 kHz, input voltage noise
- 0.28 μV p-p noise (0.1 Hz to 10 Hz) |
• Excellent ac specifications
- 120 kHz bandwidth (G = 100)
- 15 μs settling time to 0.01% |
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| CATALOG |
| AD620ARZ-REEL COUNTRY OF ORIGIN |
| AD620ARZ-REEL PARAMETRIC INFO |
| AD620ARZ-REEL PACKAGE INFO |
| AD620ARZ-REEL MANUFACTURING INFO |
| AD620ARZ-REEL PACKAGING INFO |
| AD620ARZ-REEL ECAD MODELS |
| AD620ARZ-REEL APPLICATIONS |
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| COUNTRY OF ORIGIN |
| China |
| Taiwan (Province of China) |
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| PARAMETRIC INFO |
| Number of Channels per Chip |
1 |
| Maximum Input Offset Voltage (mV) |
0.125@±15V |
| Maximum Input Bias Current (uA) |
0.002@±15V |
| Minimum CMRR (dB) |
73 |
| Maximum Quiescent Current (mA) |
1.3@±15V |
| Minimum CMRR Range (dB) |
60 to 75 |
| Minimum Dual Supply Voltage (V) |
±2.3 |
| Maximum Input Resistance (MOhm) |
10000(Typ)@±15V |
| Maximum Dual Supply Voltage (V) |
±18 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Minimum Storage Temperature (°C) |
-65 |
| Power Supply Type |
Dual |
| Maximum Supply Voltage Range (V) |
30 to 50 |
| Typical Dual Supply Voltage (V) |
±3|±5|±9|±12|±15 |
| Maximum Operating Supply Voltage (V) |
±18 |
| Maximum Power Dissipation (mW) |
650 |
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| |
| PACKAGE INFO |
| Supplier Package |
SOIC N |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
5(Max) |
| Package Width (mm) |
4(Max) |
| Package Height (mm) |
1.5(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5(Max) |
| Package Overall Width (mm) |
6.2(Max) |
| Package Overall Height (mm) |
1.75(Max) |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC Narrow Body |
| Package Family Name |
SO |
| Jedec |
MS-012AA |
| Package Outline |
Link to Datasheet |
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| |
| MANUFACTURING INFO |
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
300 |
| Wave Solder Time (Sec) |
10 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
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| |
| PACKAGING INFO |
| Packaging Suffix |
REEL |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
| Tape Material |
Plastic |
| Tape Type |
Embossed |
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| |
| ECAD MODELS |
 |
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| APPLICATIONS |
| • Weigh scales |
| • ECG and medical instrumentation |
| • Transducer interface |
| • Data acquisition systems |
| • Industrial process controls |
| • Battery-powered and portable equipment |
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