AD620SQ/883B Analog Devices IC AMP INST LP LN 18MA 8CERDIP

label:
2024/01/9 308


• Easy to use
   - Gain set with one external resistor
      - (Gain range 1 to 10,000)
   - Wide power supply range (±2.3 V to ±18 V)
   - Higher performance than 3 op amp IA designs
   - Available in 8-lead DIP and SOIC packaging
   - Low power, 1.3 mA max supply current  
• Excellent dc performance (B grade)
   - 50 μV max, input offset voltage
   - 0.6 μV/°C max, input offset drift
   - 1.0 nA max, input bias current
   - 100 dB min common-mode rejection ratio (G = 10)   
• Low noise
   - 9 nV/√Hz @ 1 kHz, input voltage noise
   - 0.28 μV p-p noise (0.1 Hz to 10 Hz)
• Excellent ac specifications
   - 120 kHz bandwidth (G = 100)
   - 15 μs settling time to 0.01%  


CATALOG
AD620SQ/883B COUNTRY OF ORIGIN
AD620SQ/883B PARAMETRIC INFO
AD620SQ/883B PACKAGE INFO
AD620SQ/883B MANUFACTURING INFO
AD620SQ/883B PACKAGING INFO
AD620SQ/883B ECAD MODELS
AD620SQ/883B APPLICATIONS  


COUNTRY OF ORIGIN
Taiwan (Province of China)
Philippines


PARAMETRIC INFO
Number of Channels per Chip 1
Maximum Input Offset Voltage (mV) 0.125@±15V
Maximum Input Bias Current (uA) 0.002@±15V
Minimum CMRR (dB) 73
Maximum Quiescent Current (mA) 1.3@±15V
Minimum CMRR Range (dB) 75 to 85
Minimum Dual Supply Voltage (V) ±2.3
Maximum Input Resistance (MOhm) 10000(Typ)@±15V
Maximum Dual Supply Voltage (V) ±18
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 125
Minimum Storage Temperature (°C) -65
Power Supply Type Dual
Maximum Supply Voltage Range (V) 30 to 50
Typical Dual Supply Voltage (V) ±3|±5|±9|±12|±15
Maximum Operating Supply Voltage (V) ±18
Maximum Power Dissipation (mW) 650
 


PACKAGE INFO
Supplier Package CDIP
Basic Package Type Through Hole
Pin Count 8
Lead Shape Through Hole
PCB 8
Tab N/R
Pin Pitch (mm) 2.54
Package Length (mm) 10.29(Max)
Package Width (mm) 7.87(Max)
Package Height (mm) 3.56(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 5.08(Max)
Mounting Through Hole
Package Material Ceramic
Package Description Ceramic Dual In Line Package
Package Family Name DIP
Jedec MS-030AA
Package Outline Link to Datasheet
 


MANUFACTURING INFO
MSL N/R
Maximum Reflow Temperature (°C) N/R
Reflow Solder Time (Sec) N/R
Maximum Wave Temperature (°C) N/A
Wave Solder Time (Sec) N/A
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) SnPb
Under Plating Material N/A
Terminal Base Material FeNi Alloy
Number of Wave Cycles N/A
 


PACKAGING INFO
Packaging Tube
Quantity Of Packaging 48
Packaging Document Link to Datasheet
 


ECAD MODELS


APPLICATIONS  
• Weigh scales
• ECG and medical instrumentation
• Transducer interface  
• Data acquisition systems
• Industrial process controls
• Battery-powered and portable equipment

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