AD620SQ/883B Analog Devices IC AMP INST LP LN 18MA 8CERDIP

label:

2024/01/9 317

• Easy to use
- Gain set with one external resistor
- (Gain range 1 to 10,000)
- Wide power supply range (±2.3 V to ±18 V)
- Higher performance than 3 op amp IA designs
- Available in 8-lead DIP and SOIC packaging
- Low power, 1.3 mA max supply current

• Excellent dc performance (B grade)
- 50 μV max, input offset voltage
- 0.6 μV/°C max, input offset drift
- 1.0 nA max, input bias current
- 100 dB min common-mode rejection ratio (G = 10)

• Low noise
- 9 nV/√Hz @ 1 kHz, input voltage noise
- 0.28 μV p-p noise (0.1 Hz to 10 Hz)

• Excellent ac specifications
- 120 kHz bandwidth (G = 100)
- 15 μs settling time to 0.01%

CATALOG

AD620SQ/883B COUNTRY OF ORIGIN

AD620SQ/883B PARAMETRIC INFO

AD620SQ/883B PACKAGE INFO

AD620SQ/883B MANUFACTURING INFO

AD620SQ/883B PACKAGING INFO

AD620SQ/883B ECAD MODELS

AD620SQ/883B APPLICATIONS

COUNTRY OF ORIGIN

Taiwan (Province of China)

Philippines

PARAMETRIC INFO

Number of Channels per Chip	1
Maximum Input Offset Voltage (mV)	0.125@±15V
Maximum Input Bias Current (uA)	0.002@±15V
Minimum CMRR (dB)	73
Maximum Quiescent Current (mA)	1.3@±15V
Minimum CMRR Range (dB)	75 to 85
Minimum Dual Supply Voltage (V)	±2.3
Maximum Input Resistance (MOhm)	10000(Typ)@±15V
Maximum Dual Supply Voltage (V)	±18
Minimum Operating Temperature (°C)	-55
Maximum Operating Temperature (°C)	125
Minimum Storage Temperature (°C)	-65
Power Supply Type	Dual
Maximum Supply Voltage Range (V)	30 to 50
Typical Dual Supply Voltage (V)	±3\|±5\|±9\|±12\|±15
Maximum Operating Supply Voltage (V)	±18
Maximum Power Dissipation (mW)	650

PACKAGE INFO

Supplier Package	CDIP
Basic Package Type	Through Hole
Pin Count	8
Lead Shape	Through Hole
PCB	8
Tab	N/R
Pin Pitch (mm)	2.54
Package Length (mm)	10.29(Max)
Package Width (mm)	7.87(Max)
Package Height (mm)	3.56(Max)
Package Diameter (mm)	N/R
Seated Plane Height (mm)	5.08(Max)
Mounting	Through Hole
Package Material	Ceramic
Package Description	Ceramic Dual In Line Package
Package Family Name	DIP
Jedec	MS-030AA
Package Outline	Link to Datasheet

MANUFACTURING INFO

MSL	N/R
Maximum Reflow Temperature (°C)	N/R
Reflow Solder Time (Sec)	N/R
Maximum Wave Temperature (°C)	N/A
Wave Solder Time (Sec)	N/A
Wave Temp. Source	Link to Datasheet
Lead Finish(Plating)	SnPb
Under Plating Material	N/A
Terminal Base Material	FeNi Alloy
Number of Wave Cycles	N/A

PACKAGING INFO

Packaging	Tube
Quantity Of Packaging	48
Packaging Document	Link to Datasheet

ECAD MODELS

APPLICATIONS

• Weigh scales

• ECG and medical instrumentation

• Transducer interface

• Data acquisition systems

• Industrial process controls

• Battery-powered and portable equipment