AD6676BCBZRL Analog Devices CTSD BPO ADC 100 MHZ BW

label:

2023/10/20 324

• High instantaneous dynamic range
- Noise figure (NF) as low as 13 dB
- Noise spectral density (NSD) as low as −159 dBFS/Hz
- IIP3 up to 36.9 dBm with spurious tones <−99 dBFS

• Tunable band-pass Σ-Δ analog-to-digital converter (ADC)
- 20 MHz to 160 MHz signal bandwidth
- 70 MHz to 450 MHz IF center frequency
- Configurable input full-scale level of −2 dBm to −14 dBm Easy to drive resistive IF input
- Gain flatness of 1 dB with under 0.5 dB out-of-band peaking Alias rejection greater than 50 dB
- 2.0 GSPS to 3.2 GSPS ADC clock rate On-chip PLL clock multiplier
- 16-bit I/Q rate up to 266 MSPS

• On-chip digital signal processing
- NCO and quadrature digital downconverter (QDDC)
- Selectable decimation factor of 12, 16, 24, and 32

• Automatic gain control (AGC) support
- On-chip attenuator with 27 dB span in 1 dB steps
- Fast attenuator control via configurable AGC data port
- Peak detection flags with programmable thresholds

• Single or dual lane, JESD204B capable

• Low power consumption: 1.20 W
- 1.1 V and 2.5 V supply voltage
- TDD power saving up to 60%

• 4.3 mm × 5.0 mm WLCSP

CATALOG

AD6676BCBZRL COUNTRY OF ORIGIN

AD6676BCBZRL PARAMETRIC INFO

AD6676BCBZRL PACKAGE INFO

AD6676BCBZRL MANUFACTURING INFO

AD6676BCBZRL PACKAGING INFO

AD6676BCBZRL ECAD MODELS

AD6676BCBZRL FUNCTIONAL BLOCK DIAGRAM

AD6676BCBZRL APPLICATIONS

COUNTRY OF ORIGIN

Taiwan (Province of China)

PARAMETRIC INFO

Category	Receiver
Maximum RF Operating Frequency Range (MHz)	100 to 500
Maximum Data Rate	5.333Gbps
Operating Band Frequency (MHz)	20 to 160\|70 to 450
Maximum RF Operating Frequency (MHz)	450
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	85
Typical Operating Supply Voltage	1.1V\|2.5V
Minimum Operating Supply Voltage	1.0725V\|2.4375V
Operating Supply Voltage	1.1V\|2.5V
Maximum Operating Supply Voltage	1.1275V\|2.5625V

PACKAGE INFO

Supplier Package	WLCSP
Basic Package Type	Ball Grid Array
Pin Count	80
Lead Shape	Ball
PCB	80
Tab	N/R
Package Length (mm)	5.04
Package Width (mm)	4.29
Package Height (mm)	0.36
Package Diameter (mm)	N/R
Mounting	Surface Mount
Package Material	Plastic
Package Description	Wafer Level Chip Scale Package
Package Family Name	CSP
Package Outline	Link to Datasheet

MANUFACTURING INFO

MSL	1
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	30
Number of Reflow Cycle	3
Standard	J-STD-020D
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Lead Finish(Plating)	SnAgCu
Under Plating Material	N/A
Terminal Base Material	N/A

PACKAGING INFO

Packaging Suffix	RL
Packaging	Tape and Reel
Quantity Of Packaging	2000
Reel Diameter (in)	13
Packaging Document	Link to Datasheet

ECAD MODELS

FUNCTIONAL BLOCK DIAGRAM

APPLICATIONS

• Wideband cellular infrastructure equipment and repeaters

• Point-to-point microwave equipment

• Instrumentation
- Spectrum and communication analyzers

• Software defined radio