AD708BQ Analog Devices IC OPAMP GP 900KHZ 8CDIP

label:
2023/10/25 245



• Very high dc precision :30 μV maximum offset voltage 0.3 μV/°C maximum offset voltage drift 0.35 μV p-p maximum voltage noise (0.1 Hz to 10 Hz) 5 million V/V minimum open-loop gain 130 dB minimum CMRR 120 dB minimum PSRR
• Matching characteristics:30 μV maximum offset voltage match 0.3 μV/°C maximum offset voltage drift match 130 dB minimum CMRR match
• Available in 8-lead narrow body, PDIP, and hermetic CERDIP and CERDIP/883B packages


CATALOG
AD708BQ COUNTRY OF ORIGIN
AD708BQ PARAMETRIC INFO
AD708BQ PACKAGE INFO
AD708BQ MANUFACTURING INFO
AD708BQ PACKAGING INFO
AD708BQ ECAD MODELS


COUNTRY OF ORIGIN
United States of America
China
Philippines


PARAMETRIC INFO
Manufacturer Type Precision Amplifier
Type Precision Amplifier
Number of Channels per Chip 2
Process Technology Bipolar
Minimum PSRR (dB) 120
Minimum Dual Supply Voltage (V) ±3
Typical Gain Bandwidth Product (MHz) 0.9
Maximum Input Offset Voltage (mV) 0.05@±15V
Typical Dual Supply Voltage (V) ±5|±9|±12|±15
Maximum Input Offset Current (uA) 0.001@±15V
Maximum Dual Supply Voltage (V) ±18
Maximum Operating Supply Voltage (V) ±18
Maximum Input Bias Current (uA) 0.001@±15V
Minimum CMRR (dB) 130
Maximum Supply Voltage Range (V) 36 to 37
Minimum CMRR Range (dB) >=115
Typical Voltage Gain (dB) 140
Typical Slew Rate (V/us) 0.3@±15V
Typical Input Noise Voltage Density (nV/rtHz) 10.3@±15V
Typical Noninverting Input Current Noise Density (pA/rtHz) 0.32@±15V
Shut Down Support No
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 70
Supplier Temperature Grade Industrial
Power Supply Type Dual


PACKAGE INFO
Supplier Package CDIP
Basic Package Type Through Hole
Pin Count 8
Lead Shape Through Hole
PCB 8
Tab N/R
Pin Pitch (mm) 2.54
Package Length (mm) 10.29(Max)
Package Width (mm) 7.87(Max)
Package Height (mm) 3.56(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 5.08(Max)
Mounting Through Hole
Package Material Ceramic
Package Description Ceramic Dual In Line Package
Package Family Name DIP
Jedec N/A


MANUFACTURING INFO
MSL N/R
Maximum Reflow Temperature (°C) N/R
Reflow Solder Time (Sec) N/R
Maximum Wave Temperature (°C) 300
Wave Solder Time (Sec) 60
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) SnPb
Under Plating Material N/A
Terminal Base Material FeNi Alloy


PACKAGING INFO
Packaging Tube
Quantity Of Packaging 48


ECAD MODELS


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