AD708BQ Analog Devices IC OPAMP GP 900KHZ 8CDIP

label:

2023/10/25 330

• Very high dc precision ：30 μV maximum offset voltage 0.3 μV/°C maximum offset voltage drift 0.35 μV p-p maximum voltage noise (0.1 Hz to 10 Hz) 5 million V/V minimum open-loop gain 130 dB minimum CMRR 120 dB minimum PSRR

• Matching characteristics：30 μV maximum offset voltage match 0.3 μV/°C maximum offset voltage drift match 130 dB minimum CMRR match

• Available in 8-lead narrow body, PDIP, and hermetic CERDIP and CERDIP/883B packages

CATALOG

AD708BQ COUNTRY OF ORIGIN

AD708BQ PARAMETRIC INFO

AD708BQ PACKAGE INFO

AD708BQ MANUFACTURING INFO

AD708BQ PACKAGING INFO

AD708BQ ECAD MODELS

COUNTRY OF ORIGIN

United States of America

China

Philippines

PARAMETRIC INFO

Manufacturer Type	Precision Amplifier
Type	Precision Amplifier
Number of Channels per Chip	2
Process Technology	Bipolar
Minimum PSRR (dB)	120
Minimum Dual Supply Voltage (V)	±3
Typical Gain Bandwidth Product (MHz)	0.9
Maximum Input Offset Voltage (mV)	0.05@±15V
Typical Dual Supply Voltage (V)	±5\|±9\|±12\|±15
Maximum Input Offset Current (uA)	0.001@±15V
Maximum Dual Supply Voltage (V)	±18
Maximum Operating Supply Voltage (V)	±18
Maximum Input Bias Current (uA)	0.001@±15V
Minimum CMRR (dB)	130
Maximum Supply Voltage Range (V)	36 to 37
Minimum CMRR Range (dB)	>=115
Typical Voltage Gain (dB)	140
Typical Slew Rate (V/us)	0.3@±15V
Typical Input Noise Voltage Density (nV/rtHz)	10.3@±15V
Typical Noninverting Input Current Noise Density (pA/rtHz)	0.32@±15V
Shut Down Support	No
Minimum Operating Temperature (°C)	0
Maximum Operating Temperature (°C)	70
Supplier Temperature Grade	Industrial
Power Supply Type	Dual

PACKAGE INFO

Supplier Package	CDIP
Basic Package Type	Through Hole
Pin Count	8
Lead Shape	Through Hole
PCB	8
Tab	N/R
Pin Pitch (mm)	2.54
Package Length (mm)	10.29(Max)
Package Width (mm)	7.87(Max)
Package Height (mm)	3.56(Max)
Package Diameter (mm)	N/R
Seated Plane Height (mm)	5.08(Max)
Mounting	Through Hole
Package Material	Ceramic
Package Description	Ceramic Dual In Line Package
Package Family Name	DIP
Jedec	N/A

MANUFACTURING INFO

MSL	N/R
Maximum Reflow Temperature (°C)	N/R
Reflow Solder Time (Sec)	N/R
Maximum Wave Temperature (°C)	300
Wave Solder Time (Sec)	60
Wave Temp. Source	Link to Datasheet
Lead Finish(Plating)	SnPb
Under Plating Material	N/A
Terminal Base Material	FeNi Alloy

PACKAGING INFO

Packaging	Tube
Quantity Of Packaging	48

ECAD MODELS