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• 8/6/4 simultaneously sampled inputs |
• True bipolar analog input ranges: ±10 V, ±5 V |
• Pin to pin compatible with the state-of-the-art AD7606B |
• Single 5 V analog supply and 2.3 V to 5 V VDRIVE |
• Fully integrated data acquisition solution
Analog input clamp protection
Input buffer with 1 MΩ analog input impedance
Second-order antialiasing analog filter
On-chip accurate reference and reference buffer
16-bit ADC with 200 kSPS on all channels
Oversampling capability with digital filter
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• Flexible parallel/serial interface
SPI/QSPI™/MICROWIRE™/DSP compatible |
• Performance
7 kV ESD rating on analog input channels
95.5 dB SNR, −107 dB THD
±0.5 LSB INL, ±0.5 LSB DNL
Low power: 100 mW
Standby mode: 25 mW
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• Temperature range: −40°C to +85°C |
• 64-lead LQFP package |
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CATALOG |
AD7606BSTZ COUNTRY OF ORIGIN |
AD7606BSTZ PARAMETRIC INFO |
AD7606BSTZ PACKAGE INFO |
AD7606BSTZ MANUFACTURING INFO |
AD7606BSTZ PACKAGING INFO |
AD7606BSTZ ECAD MODELS |
AD7606BSTZ APPLICATIONS |
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COUNTRY OF ORIGIN |
China |
Taiwan (Province of China) |
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PARAMETRIC INFO |
Converter Type |
General Purpose |
Input Type |
Voltage |
Architecture |
SAR |
Resolution |
16bit |
Number of ADCs |
1 |
Sampling Rate |
200ksps |
Digital Interface Type |
Parallel|Serial (SPI, QSPI, Microwire) |
Voltage Reference |
Internal|External |
Input Signal Type |
Single-Ended |
Polarity of Input Voltage |
Bipolar |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Minimum Storage Temperature (°C) |
-65 |
Maximum Storage Temperature (°C) |
150 |
Integral Nonlinearity Error |
±2LSB |
Signal to Noise Ratio |
95.5dB(Typ) |
Sample and Hold |
Yes |
Number of Input Channels |
8 |
Single-Ended Input |
Yes |
Differential Input |
No |
Input Voltage |
±5V/±10V |
No Missing Codes (bit) |
16 |
Full Scale Error |
±32LSB |
Differential Nonlinearity |
±0.99LSB |
Voltage Supply Source |
Single |
Minimum Single Supply Voltage (V) |
4.75 |
Typical Single Supply Voltage (V) |
5 |
Maximum Single Supply Voltage (V) |
5.25 |
Digital Supply Support |
No |
Typical Power Dissipation (mW) |
100 |
Maximum Power Dissipation (mW) |
142 |
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PACKAGE INFO |
Supplier Package |
LQFP |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
64 |
Lead Shape |
Gull-wing |
PCB |
64 |
Tab |
N/R |
Pin Pitch (mm) |
0.5 |
Package Length (mm) |
10 |
Package Width (mm) |
10 |
Package Height (mm) |
1.4 |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
12 |
Package Overall Width (mm) |
12 |
Package Overall Height (mm) |
1.6(Max) |
Seated Plane Height (mm) |
1.6(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Low Profile Quad Flat Package |
Package Family Name |
QFP |
Jedec |
MS-026BCD |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO |
MSL |
3 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Matte Sn annealed |
Under Plating Material |
Ag |
Terminal Base Material |
Cu Alloy |
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PACKAGING INFO |
Packaging |
Tray |
Quantity Of Packaging |
160 |
Packaging Document |
Link to Datasheet |
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ECAD MODELS |
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APPLICATIONS |
• Power-line monitoring and protection systems
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• Multiphase motor control
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• Instrumentation and control systems |
• Multiaxis positioning systems |
• Data acquisition systems (DAS) |
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