 |
|
| • 8/6/4 simultaneously sampled inputs |
| • True bipolar analog input ranges: ±10 V, ±5 V |
| • Pin to pin compatible with the state-of-the-art AD7606B |
| • Single 5 V analog supply and 2.3 V to 5 V VDRIVE |
• Fully integrated data acquisition solution
- Analog input clamp protection
- Input buffer with 1 MΩ analog input impedance
- Second-order antialiasing analog filter
- On-chip accurate reference and reference buffer
- 16-bit ADC with 200 kSPS on all channels
- Oversampling capability with digital filter |
• Flexible parallel/serial interface
- SPI/QSPI™/MICROWIRE™/DSP compatible |
• Performance
- 7 kV ESD rating on analog input channels
- 95.5 dB SNR, −107 dB THD
- ±0.5 LSB INL,±0.5 LSB DNL
- Low power:100 mW
- Standby mode: 25 mW |
| • Temperature range: −40°C to +85°C |
| • 64-lead LQFP package |
|
| CATALOG |
| AD7606BSTZ-RL COUNTRY OF ORIGIN |
| AD7606BSTZ-RL PARAMETRIC INFO |
| AD7606BSTZ-RL PACKAGE INFO |
| AD7606BSTZ-RL MANUFACTURING INFO |
| AD7606BSTZ-RL PACKAGING INFO |
| AD7606BSTZ-RL ECAD MODELS |
| AD7606BSTZ-RL FUNCTIONAL BLOCK DIAGRAM |
| AD7606BSTZ-RL APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| China |
| Taiwan (Province of China) |
|
| PARAMETRIC INFO |
| Converter Type |
General Purpose |
| Input Type |
Voltage |
| Architecture |
SAR |
| Resolution |
16bit |
| Number of ADCs |
1 |
| Sampling Rate |
200ksps |
| Digital Interface Type |
Parallel|Serial (SPI, QSPI, Microwire) |
| Voltage Reference |
Internal|External |
| Input Signal Type |
Single-Ended |
| Polarity of Input Voltage |
Bipolar |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Integral Nonlinearity Error |
±2LSB |
| Signal to Noise Ratio |
95.5dB(Typ) |
| Sample and Hold |
Yes |
| Number of Input Channels |
8 |
| Single-Ended Input |
Yes |
| Differential Input |
No |
| Input Voltage |
±5V/±10V |
| No Missing Codes (bit) |
16 |
| Full Scale Error |
±32LSB |
| Differential Nonlinearity |
±0.99LSB |
| Voltage Supply Source |
Single |
| Minimum Single Supply Voltage (V) |
4.75 |
| Typical Single Supply Voltage (V) |
5 |
| Maximum Single Supply Voltage (V) |
5.25 |
| Digital Supply Support |
No |
| Typical Power Dissipation (mW) |
100 |
| Maximum Power Dissipation (mW) |
142 |
|
| |
| PACKAGE INFO |
| Supplier Package |
LQFP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
64 |
| Lead Shape |
Gull-wing |
| PCB |
64 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
10 |
| Package Width (mm) |
10 |
| Package Height (mm) |
1.4 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
12 |
| Package Overall Width (mm) |
12 |
| Package Overall Height (mm) |
1.6(Max) |
| Seated Plane Height (mm) |
1.6(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Low Profile Quad Flat Package |
| Package Family Name |
QFP |
| Jedec |
MS-026BCD |
| Package Outline |
Link to Datasheet |
|
| |
| MANUFACTURING INFO |
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
|
| |
| PACKAGING INFO |
| Packaging Suffix |
RL |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1500 |
|
| |
| ECAD MODELS |
 |
|
| FUNCTIONAL BLOCK DIAGRAM |
 |
|
| APPLICATIONS |
| • Power-line monitoring and protection systems |
| • Multiphase motor control |
| • Instrumentation and control systems |
| • Multiaxis positioning systems |
| • Data acquisition systems (DAS) |
|
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