|
|
• 16-bit resolution with no missing codes
|
• Throughput: 250 kSPS
|
• INL: ±0.6 LSB typical, ±2 LSB maximum (±0.003% of FSR)
|
• SINAD: 93.5 dB at 20 kHz
|
• THD: −110 dB at 20 kHz
|
|
| CATALOG |
AD7685BRMZRL7 COUNTRY OF ORIGIN
|
AD7685BRMZRL7 PARAMETRIC INFO
|
AD7685BRMZRL7 PACKAGE INFO
|
AD7685BRMZRL7 MANUFACTURING INFO
|
AD7685BRMZRL7 PACKAGING INFO
|
AD7685BRMZRL7 ECAD MODELS
|
AD7685BRMZRL7 APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Malaysia
|
|
PARAMETRIC INFO
|
| Converter Type |
General Purpose |
| Input Type |
Voltage |
| Architecture |
SAR |
| Resolution |
16bit |
| Maximum Conversion Time (us) |
3.2 |
| Number of ADCs |
1 |
| Sampling Rate |
250ksps |
| Maximum Analog Input Voltage |
7.3V |
| Minimum Analog Input Voltage |
-0.3V |
| Multiplying Function |
Yes |
| Output Code |
Straight Binary |
| Interface Type |
Serial (3-Wire, 4-Wire, SPI, QSPI, Microwire) |
| Voltage Reference |
External |
| Minimum Positive Supply Voltage (V) |
2.3 |
| Input Signal Type |
Pseudo-Differential |
| Maximum Positive Supply Voltage (V) |
5.5 |
| Polarity of Input Voltage |
Unipolar |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Integral Nonlinearity Error |
±3LSB |
| Signal to Noise Ratio |
92dB(Typ) |
| Sample and Hold |
Yes |
| Number of Input Channels |
1 |
| Single-Ended Input |
No |
| Differential Input |
Yes |
| Input Voltage |
5.8V |
| No Missing Codes (bit) |
16 |
| Full Scale Error |
±30LSB |
| Differential Nonlinearity |
±0.7LSB(Typ) |
| Voltage Supply Source |
Single |
| Minimum Single Supply Voltage (V) |
2.3 |
| Typical Single Supply Voltage (V) |
2.5|3.3|5 |
| Maximum Single Supply Voltage (V) |
5.5 |
| Digital Supply Support |
No |
| Typical Power Dissipation (mW) |
10 |
| Maximum Power Dissipation (mW) |
15 |
| Serial Interface |
Serial SPI |
|
|
PACKAGE INFO
|
| Supplier Package |
MSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
10 |
| Lead Shape |
Gull-wing |
| PCB |
10 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
3 |
| Package Width (mm) |
3 |
| Package Height (mm) |
0.85 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3 |
| Package Overall Width (mm) |
4.9 |
| Package Overall Height (mm) |
0.95 |
| Seated Plane Height (mm) |
0.95 |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
0.23 |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Micro Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-187BA |
| Package Outline |
Link to Datasheet |
| Maximum PACKAGE_DIMENSION_H |
0.95 |
| Minimum PACKAGE_DIMENSION_H |
0.75 |
| Maximum PACKAGE_DIMENSION_L |
3.1 |
| Minimum PACKAGE_DIMENSION_L |
2.9 |
| Maximum PACKAGE_DIMENSION_W |
3.1 |
| Minimum PACKAGE_DIMENSION_W |
2.9 |
| Maximum Diameter |
N/R |
| Minimum Diameter |
N/R |
| Maximum Seated_Plane_Height |
1.1 |
| Minimum Seated_Plane_Height |
0.8 |
| Ball Array Length (mm) |
N/R |
| Ball Array Width (mm) |
N/R |
| Stand-off Height (mm) |
0.1 |
| Number of Column Balls |
N/R |
| Number of Row Balls |
N/R |
| Terminal Length (mm) |
0.55 |
| Terminal Thickness (mm) |
0.18 |
| Bottom Pad Length (mm) |
N/R |
| Bottom Pad Width (mm) |
N/R |
| Bottom Pad Chamfer |
N/R |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
RL7 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1000 |
| Reel Diameter (in) |
7 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
| Tape Material |
Plastic |
| Tape Type |
Embossed |
|
| |
| ECAD MODELS |
 |
|
| APPLICATIONS |
| • Data acquisition |
| • Instrumentation |
| • Process controls |
| • Battery-powered equipment Medical instruments Mobile communications Personal digital assistants (PDAs) |
| |
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