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| ► Pin programmable 2.5 V or 3.0 V output
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| ► Ultralow drift: 3 ppm/°C max
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| ► High accuracy: 2.5 V or 3.0 V ±1 mV max |
| ► Low noise: 100 nV/√Hz |
| ► Noise reduction capability |
| ► Low quiescent current: 1 mA max |
| ► Output trim capability |
| ► Plug-in upgrade for present references
|
| ► Temperature output pin |
| ► Series or shunt mode operation (±2.5 V, ±3.0 V)
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|
| CATALOG |
| AD780BNZ COUNTRY OF ORIGIN |
| AD780BNZ PARAMETRIC INFO |
| AD780BNZ PACKAGE INFO |
| AD780BNZ MANUFACTURING INFO |
| AD780BNZ PACKAGING INFO |
| AD780BNZ ECAD MODELS |
| AD780BNZ FUNCTIONAL BLOCK DIAGRAM |
|
| COUNTRY OF ORIGIN |
| Philippines |
| Malaysia |
| United States of America |
|
| PARAMETRIC INFO |
| Topology |
Shunt|Series |
| Reference Type |
Programmable |
| Output Voltage (V) |
2.5/3 |
| Initial Accuracy |
1mV |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Load Regulation |
75uV/mA |
| Line Regulation |
10uV/V |
| Maximum Input Voltage (V) |
36 |
| Maximum Output Current (mA) |
10 |
| Maximum Temperature Coefficient |
3ppm/°C |
|
| |
| PACKAGE INFO |
| Supplier Package |
PDIP N |
| Basic Package Type |
Through Hole |
| Pin Count |
8 |
| Lead Shape |
Through Hole |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
2.54 |
| Package Length (mm) |
9.27 |
| Package Width (mm) |
6.35 |
| Package Height (mm) |
3.3 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
9.27 |
| Package Overall Width (mm) |
10.92(Max) |
| Package Overall Height (mm) |
5.33(Max) |
| Seated Plane Height (mm) |
5.33(Max) |
| Mounting |
Through Hole |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Plastic Dual In Line Package Narrow Body |
| Package Family Name |
DIP |
| Jedec |
MS-001BA |
| Package Outline |
Link to Datasheet |
|
| |
| MANUFACTURING INFO |
| MSL |
N/R |
| Maximum Reflow Temperature (°C) |
N/R |
| Reflow Solder Time (Sec) |
N/R |
| Number of Reflow Cycle |
N/R |
| Standard |
N/R |
| Maximum Wave Temperature (°C) |
N/A |
| Wave Solder Time (Sec) |
N/A |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/A |
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| |
| PACKAGING INFO |
| Packaging |
Tube |
| Quantity Of Packaging |
50 |
|
| |
| ECAD MODELS |
 |
|
| FUNCTIONAL BLOCK DIAGRAM |
 |
| |
| |
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