
|
| |
• Eight 14-Bit DACs in One Package
|
• Voltage Outputs
|
• Offset Adjust for Each DAC Pair
|
| • Reference Range of 5 V |
| • Maximum Output Voltage Range of 10 V |
| • 15 V 10% Operation |
| • Clear Function to User-Defined Voltage |
| • 44-Lead MQFP Package |
|
| CATALOG |
| AD7841ASZ COUNTRY OF ORIGIN |
AD7841ASZ PARAMETRIC INFO
|
AD7841ASZ PACKAGE INFO
|
AD7841ASZ MANUFACTURING INFO
|
AD7841ASZ PACKAGING INFO
|
AD7841ASZ EACD MODELS
|
| AD7841ASZ FUNCTIONAL BLOCK DIAGRAM |
| AD7841ASZ APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| China |
| Philippines |
|
PARAMETRIC INFO
|
| Architecture |
R-2R |
| Resolution |
14bit |
| Number of DAC Channels |
8 |
| Number of Outputs per Chip |
8 |
| Conversion Rate |
32ksps |
| Converter Type |
General Purpose |
| Output Type |
Voltage |
| Voltage Reference |
External |
| Maximum Settling Time (us) |
31(Typ) |
| Digital Interface Type |
Parallel |
| Output Polarity |
Unipolar|Bipolar |
| Integral Nonlinearity Error |
±4LSB |
| Full Scale Error |
±8LSB |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Power Supply Type |
Dual |
| Minimum Dual Supply Voltage (V) |
±13.5 |
| Typical Dual Supply Voltage (V) |
±15 |
| Maximum Dual Supply Voltage (V) |
±16.5 |
| Digital Supply Support |
Yes |
| Maximum Power Dissipation (mW) |
303(Typ) |
|
|
PACKAGE INFO
|
| Supplier Package |
MQFP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
44 |
| Lead Shape |
Gull-wing |
| PCB |
44 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.8 |
| Package Length (mm) |
10 |
| Package Width (mm) |
10 |
| Package Height (mm) |
2 |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
2.45(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Metric Quad Flat Package |
| Package Family Name |
QFP |
| Jedec |
MO-112AA-2 |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging |
Tray |
| Quantity Of Packaging |
96 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|

|
|
| FUNCTIONAL BLOCK DIAGRAM |

|
|
| APPLICATIONS |
| • Automatic Test Equipment |
| • Process Control |
| • General Purpose Instrumentation |