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• Eight 14-Bit DACs in One Package
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• Voltage Outputs
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• Offset Adjust for Each DAC Pair
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• Reference Range of 5 V |
• Maximum Output Voltage Range of 10 V |
• 15 V 10% Operation |
• Clear Function to User-Defined Voltage |
• 44-Lead MQFP Package |
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CATALOG |
AD7841ASZ COUNTRY OF ORIGIN |
AD7841ASZ PARAMETRIC INFO
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AD7841ASZ PACKAGE INFO
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AD7841ASZ MANUFACTURING INFO
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AD7841ASZ PACKAGING INFO
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AD7841ASZ EACD MODELS
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AD7841ASZ FUNCTIONAL BLOCK DIAGRAM |
AD7841ASZ APPLICATIONS |
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COUNTRY OF ORIGIN |
China |
Philippines |
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PARAMETRIC INFO
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Architecture |
R-2R |
Resolution |
14bit |
Number of DAC Channels |
8 |
Number of Outputs per Chip |
8 |
Conversion Rate |
32ksps |
Converter Type |
General Purpose |
Output Type |
Voltage |
Voltage Reference |
External |
Maximum Settling Time (us) |
31(Typ) |
Digital Interface Type |
Parallel |
Output Polarity |
Unipolar|Bipolar |
Integral Nonlinearity Error |
±4LSB |
Full Scale Error |
±8LSB |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Supplier Temperature Grade |
Industrial |
Power Supply Type |
Dual |
Minimum Dual Supply Voltage (V) |
±13.5 |
Typical Dual Supply Voltage (V) |
±15 |
Maximum Dual Supply Voltage (V) |
±16.5 |
Digital Supply Support |
Yes |
Maximum Power Dissipation (mW) |
303(Typ) |
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PACKAGE INFO
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Supplier Package |
MQFP |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
44 |
Lead Shape |
Gull-wing |
PCB |
44 |
Tab |
N/R |
Pin Pitch (mm) |
0.8 |
Package Length (mm) |
10 |
Package Width (mm) |
10 |
Package Height (mm) |
2 |
Package Diameter (mm) |
N/R |
Seated Plane Height (mm) |
2.45(Max) |
Mounting |
Surface Mount |
Package Material |
Plastic |
Package Description |
Metric Quad Flat Package |
Package Family Name |
QFP |
Jedec |
MO-112AA-2 |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
|
MSL |
3 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Matte Sn annealed |
Under Plating Material |
Ag |
Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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Packaging |
Tray |
Quantity Of Packaging |
96 |
Packaging Document |
Link to Datasheet |
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ECAD MODELS
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FUNCTIONAL BLOCK DIAGRAM |

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APPLICATIONS |
• Automatic Test Equipment |
• Process Control |
• General Purpose Instrumentation |