AD8042ARZ-REEL7 Analog Devices IC OPAMP VFB 170MHZ RRO 8SOIC

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2024/12/30 92
AD8042ARZ-REEL7 Analog Devices  IC OPAMP VFB 170MHZ RRO 8SOIC


CATALOG
AD8042ARZ-REEL7 COUNTRY OF ORIGIN
AD8042ARZ-REEL7 PARAMETRIC INFO
AD8042ARZ-REEL7 PACKAGE INFO
AD8042ARZ-REEL7 MANUFACTURING INFO
AD8042ARZ-REEL7 PACKAGING INFO
AD8042ARZ-REEL7 ECAD MODELS
AD8042ARZ-REEL7 APPLICATIONS


COUNTRY OF ORIGIN
China


PARAMETRIC INFO
Manufacturer Type Low Power Amplifier
Type Low Power Amplifier
Rail to Rail Rail to Rail Output
Number of Channels per Chip 2
Minimum Single Supply Voltage (V) 3
Process Technology BiCOM
Minimum PSRR (dB) 72
Typical Single Supply Voltage (V) 5|9
Maximum Single Supply Voltage (V) 12
Typical Gain Bandwidth Product (MHz) 90
Minimum Dual Supply Voltage (V) ±1.5
Maximum Quiescent Current (mA) 14@±5V
Maximum Input Offset Voltage (mV) 9@5V
Typical Dual Supply Voltage (V) ±3|±5
Maximum Dual Supply Voltage (V) ±6
Maximum Input Offset Current (uA) 0.5@5V
Maximum Input Bias Current (uA) 3.2@5V
Maximum Operating Supply Voltage (V) ±6|12
Maximum Supply Voltage Range (V) 12 to 12.5
Minimum CMRR (dB) 68
Minimum CMRR Range (dB) 65 to 70
Typical Voltage Gain (dB) 100
Typical Slew Rate (V/us) 200@5V
Typical Settling Time (ns) 39
Typical Output Current (mA) 50@4.5V@-40C to 85C
Typical Input Noise Voltage Density (nV/rtHz) 15@5V
Typical Noninverting Input Current Noise Density (pA/rtHz) 0.7@5V
Shut Down Support No
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Power Supply Type Single|Dual
Maximum Power Dissipation (mW) 900


PACKAGE INFO
Supplier Package SOIC N
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 5(Max)
Package Width (mm) 4(Max)
Package Height (mm) 1.5(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 5(Max)
Package Overall Width (mm) 6.2(Max)
Package Overall Height (mm) 1.75(Max)
Seated Plane Height (mm) 1.75(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline IC Narrow Body
Package Family Name SO
Jedec MS-012AA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material Ag
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Suffix REEL7
Packaging Tape and Reel
Quantity Of Packaging 1000
Reel Diameter (in) 7
Tape Pitch (mm) 8
Tape Width (mm) 12
Component Orientation Q1
Packaging Document Link to Datasheet
Tape Material Plastic
Tape Type Embossed


ECAD MODELS



APPLICATIONS
• Video switchers
• Distribution amplifiers
• Analog-to-digital drivers
• Professional cameras
• CCD Imaging systems
• Ultrasound equipment (multichannel)
Продукт RFQ