AD8138ARMZ-REEL7 Analog Devices IC AMP DIFF LDIST LP 95MA 8MSOP

label:
2025/12/16 7
AD8138ARMZ-REEL7 Analog Devices IC AMP DIFF LDIST LP 95MA 8MSOP


• Easy to use, single-ended-to-differential conversion
• Adjustable output common-mode voltage
• Externally adjustable gain
• −3 dB bandwidth of 320 MHz, G = +1
• Fast settling to 0.01% of 16 ns


CATALOG
AD8138ARMZ-REEL7 COUNTRY OF ORIGIN
AD8138ARMZ-REEL7 PARAMETRIC INFO
AD8138ARMZ-REEL7 PACKAGE INFO
AD8138ARMZ-REEL7 MANUFACTURING INFO
AD8138ARMZ-REEL7 PACKAGING INFO
AD8138ARMZ-REEL7 ECAD MODELS
AD8138ARMZ-REEL7 APPLICATIONS


COUNTRY OF ORIGIN
China
Taiwan (Province of China)


PARAMETRIC INFO
Type Differential Amplifier
Number of Elements per Chip 1
Number of Channels per Chip 1
Minimum PSRR (dB) 70(Max)
Output Type Differential
Maximum Input Offset Voltage (mV) 2.5@5V
Maximum Input Bias Current (uA) 7@5V
Minimum CMRR (dB) 70(Max)
Minimum CMRR Range (dB) 60 to 75
Maximum Quiescent Current (mA) 21@5V
Process Technology <2.5um
Typical Output Current (mA) 95@5V
Maximum Input Resistance (MOhm) 6(Typ)@5V
Maximum Voltage Gain Range (dB) <35
Typical Slew Rate (V/us) 950@5V
Maximum Voltage Gain (dB) 0.028
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Power Supply Type Single|Dual
Maximum Supply Voltage Range (V) 10 to 15
Minimum Single Supply Voltage (V) 2.7
Typical Single Supply Voltage (V) 3|5|9
Maximum Single Supply Voltage (V) 11
Minimum Dual Supply Voltage (V) ±1.4
Typical Dual Supply Voltage (V) ±3|±5
Maximum Dual Supply Voltage (V) ±5.5
Maximum Operating Supply Voltage (V) ±5.5|11
Maximum Power Dissipation (mW) 550


PACKAGE INFO
Supplier Package MSOP
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Pin Pitch (mm) 0.65
Package Length (mm) 3
Package Width (mm) 3
Package Height (mm) 0.85
Package Diameter (mm) N/R
Package Overall Length (mm) 3
Package Overall Width (mm) 4.9
Package Overall Height (mm) 0.95
Seated Plane Height (mm) 0.95
Mounting Surface Mount
Terminal Width (mm) 0.33
Package Weight (g) N/A
Package Material Plastic
Package Description Micro Small Outline Package
Package Family Name SO
Jedec MO-187AA
Package Outline Link to Datasheet
Maximum PACKAGE_DIMENSION_H 0.95
Minimum PACKAGE_DIMENSION_H 0.75
Maximum PACKAGE_DIMENSION_L 3.2
Minimum PACKAGE_DIMENSION_L 2.8
Maximum PACKAGE_DIMENSION_W 3.2
Minimum PACKAGE_DIMENSION_W 2.8
Maximum Diameter N/R
Minimum Diameter N/R
Maximum Seated_Plane_Height 1.1
Minimum Seated_Plane_Height 0.8
Ball Array Length (mm) N/R
Ball Array Width (mm) N/R
Stand-off Height (mm) 0.1
Number of Column Balls N/R
Number of Row Balls N/R
Terminal Length (mm) 0.55
Terminal Thickness (mm) 0.16
Bottom Pad Length (mm) N/R
Bottom Pad Width (mm) N/R
Bottom Pad Chamfer N/R


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material Ag
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Suffix REEL7
Packaging Tape and Reel
Quantity Of Packaging 1000
Reel Diameter (in) 7
Tape Pitch (mm) 8
Tape Width (mm) 12
Component Orientation Q1
Packaging Document Link to Datasheet
Tape Material Plastic
Tape Type Embossed

ECAD MODELS


APPLICATIONS
• ADC drivers
• Single-ended-to-differential converters
• IF and baseband gain blocks
• Differential buffers  
• Line drivers
Продукт RFQ