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• Fully Buffered Inputs and Outputs
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• Fast Channel Switching: 10 ns
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• Low Power: < 10 mA
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• Low Crosstalk of –78 dB @ 5 MHz
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• High Disable Isolation of –88 dB @ 5 MHz
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• High Shutdown Isolation of –92 dB @ 5 MHz
|
|
| CATALOG |
AD8170ARZ-R7 COUNTRY OF ORIGIN
|
AD8170ARZ-R7 PARAMETRIC INFO
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AD8170ARZ-R7 PACKAGE INFO
|
AD8170ARZ-R7 MANUFACTURING INFO
|
AD8170ARZ-R7 PACKAGING INFO
|
AD8170ARZ-R7 ECAD MODELS
|
AD8170ARZ-R7 APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Taiwan (Province of China)
|
|
PARAMETRIC INFO
|
| Type |
Analog Multiplexer/Amp |
| Number of Channels per Chip |
1 |
| Multiplexer Architecture |
2:1 |
| Configuration |
Single 2:1 |
| Number of Inputs per Chip |
2 |
| Function |
General |
| Number of Outputs per Chip |
1 |
| Chip Enable Signals |
Yes |
| Maximum Turn-On Time (ns) |
17(Typ)@±5V |
| Maximum Turn-Off Time (ns) |
120(Typ)@±5V |
| Input Signal Type |
Single |
| Output Signal Type |
Single |
| Maximum Frequency (25°C) @ Vcc (MHz) |
250(Typ)@±5V |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Power Supply Type |
Dual |
| Minimum Dual Supply Voltage (V) |
±4 |
| Typical Dual Supply Voltage (V) |
±5 |
| Maximum Dual Supply Voltage (V) |
±6 |
|
|
PACKAGE INFO
|
| Supplier Package |
SOIC N |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
5(Max) |
| Package Width (mm) |
4(Max) |
| Package Height (mm) |
1.5(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5(Max) |
| Package Overall Width (mm) |
6.2(Max) |
| Package Overall Height (mm) |
1.75(Max) |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC Narrow Body |
| Package Family Name |
SO |
| Jedec |
MS-012AA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R7 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
750 |
| Reel Diameter (in) |
7 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
|
| APPLICATIONS |
| • Pixel Switching for “Picture-In-Picture |
| • LCD and Plasma Displays |
| • Video Routers |
| |
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