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• Easy to use
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• Available in space-saving MSOP
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• Gain set with 1 external resistor (gain range 1 to 1000)
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• Wide power supply range: ±2.3 V to ±18 V
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• Temperature range for specified performance:
−40°C to +85°C
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• Operational up to 125°C
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• Excellent AC specifications
80 dB minimum CMRR to 10 kHz (G = 1)
825 kHz, –3 dB bandwidth (G = 1)
2 V/µs slew rate
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• Low noise
8 nV/√Hz, @ 1 kHz, maximum input voltage noise
0.25 µV p-p input noise (0.1 Hz to 10 Hz)
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• High accuracy dc performance (AD8221BR)
90 dB minimum CMRR (G = 1)
25 µV maximum input offset voltage
0.3 µV/°C maximum input offset drift
0.4 nA maximum input bias current
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CATALOG |
AD8221ARZ-R7 COUNTRY OF ORIGIN
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AD8221ARZ-R7 PARAMETRIC INFO
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AD8221ARZ-R7 PACKAGE INFO
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AD8221ARZ-R7 MANUFACTURING INFO
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AD8221ARZ-R7 PACKAGING INFO
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AD8221ARZ-R7 ECAD MODELS
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AD8221ARZ-R7 APPLICATIONS
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COUNTRY OF ORIGIN
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Malaysia
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Taiwan (Province of China)
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United States of America
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PARAMETRIC INFO
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Number of Channels per Chip |
1 |
Minimum PSRR (dB) |
130 |
Maximum Input Offset Voltage (mV) |
0.06@±15V |
Maximum Input Bias Current (uA) |
0.0015@±15V |
Minimum CMRR (dB) |
130 |
Maximum Quiescent Current (mA) |
1@±15V |
Minimum CMRR Range (dB) |
>=130 |
Minimum Dual Supply Voltage (V) |
±2.3 |
Maximum Input Resistance (MOhm) |
100000(Typ)@±15V |
Maximum Dual Supply Voltage (V) |
±18 |
Maximum Voltage Gain Range (dB) |
60 to 75 |
Maximum Voltage Gain (dB) |
60 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
125 |
Supplier Temperature Grade |
Industrial |
Minimum Storage Temperature (°C) |
-65 |
Maximum Storage Temperature (°C) |
150 |
Power Supply Type |
Dual |
Maximum Supply Voltage Range (V) |
30 to 50 |
Typical Dual Supply Voltage (V) |
±3|±5|±9|±12|±15 |
Maximum Operating Supply Voltage (V) |
±18 |
Maximum Power Dissipation (mW) |
200 |
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PACKAGE INFO
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Supplier Package |
SOIC N |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
8 |
Lead Shape |
Gull-wing |
PCB |
8 |
Tab |
N/R |
Pin Pitch (mm) |
1.27 |
Package Length (mm) |
5(Max) |
Package Width (mm) |
4(Max) |
Package Height (mm) |
1.5(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
5(Max) |
Package Overall Width (mm) |
6.2(Max) |
Package Overall Height (mm) |
1.75(Max) |
Seated Plane Height (mm) |
1.75(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Small Outline IC Narrow Body |
Package Family Name |
SO |
Jedec |
MS-012AA |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Matte Sn annealed |
Under Plating Material |
Ag |
Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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Packaging Suffix |
R7 |
Packaging |
Tape and Reel |
Quantity Of Packaging |
1000 |
Reel Diameter (in) |
7 |
Tape Pitch (mm) |
8 |
Tape Width (mm) |
12 |
Component Orientation |
Q1 |
Packaging Document |
Link to Datasheet |
Tape Material |
Plastic |
Tape Type |
Embossed |
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ECAD MODELS
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APPLICATIONS
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• Weigh scales
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• Industrial process controls |
• Bridge amplifiers |
• Precision data acquisition systems |
• Medical instrumentation
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• Strain gages |
• Transducer interfaces |
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