AD8236ARMZ-R7 Analog De IC OPAMP INSTR 23KHZ RRO 8MSOP

label:
2024/02/23 307



• Low power: 40 μA supply current (maximum)
• Low input currents
   - 1 pA input bias current
   - 0.5 pA input offset current
• High CMRR: 110 dB CMRR, G = 100
• Space-saving MSOP
• Zero input crossover distortion
• Rail-to-rail input and output
• Gain set with single resistor
• Operates from 1.8 V to 5.5 V


CATALOG
AD8236ARMZ-R7 Country of Origin
AD8236ARMZ-R7 Parametric Info
AD8236ARMZ-R7 Package Info
AD8236ARMZ-R7 Manufacturing Info
AD8236ARMZ-R7 Packaging Info
AD8236ARMZ-R7 ECAD Models
AD8236ARMZ-R7 APPLICATIONS


COUNTRY OF ORIGIN
Malaysia


PARAMETRIC INFO
Rail to Rail Rail to Rail Input/Output
Number of Channels per Chip 1
Maximum Input Offset Voltage (mV) 3.5@5V
Maximum Input Bias Current (uA) 0.00001@5V
Minimum CMRR (dB) 86
Maximum Quiescent Current (mA) 0.04@1.8V
Minimum CMRR Range (dB) 75 to 85
Minimum Single Supply Voltage (V) 1.8
Maximum Single Supply Voltage (V) 5.5
Maximum Input Resistance (MOhm) 440000@5V
Maximum Voltage Gain Range (dB) 35 to 50
Maximum Voltage Gain (dB) 46.02
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Supplier Temperature Grade Industrial
Power Supply Type Single
Maximum Supply Voltage Range (V) <5
Typical Single Supply Voltage (V) 3|5
Maximum Operating Supply Voltage (V) 5.5


PACKAGE INFO
Supplier Package MSOP
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Pin Pitch (mm) 0.65
Package Length (mm) 3
Package Width (mm) 3
Package Height (mm) 0.85
Package Diameter (mm) N/R
Package Overall Length (mm) 3
Package Overall Width (mm) 4.9
Package Overall Height (mm) 1.1(Max)
Seated Plane Height (mm) 1.1(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Micro Small Outline Package
Package Family Name SO
Jedec MO-187AA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Suffix R7
Packaging Tape and Reel
Quantity Of Packaging 1000
Reel Diameter (in) 7
Packaging Document Link to Datasheet


ECAD MODELS



APPLICATIONS
• Medical instrumentation
• Low-side current sense
• Portable devices

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