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• Low power: 40 μA supply current (maximum)
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• Low input currents
- 1 pA input bias current
- 0.5 pA input offset current
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• High CMRR: 110 dB CMRR, G = 100
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• Space-saving MSOP
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• Zero input crossover distortion
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• Rail-to-rail input and output
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• Gain set with single resistor
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• Operates from 1.8 V to 5.5 V
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CATALOG |
AD8236ARMZ-R7 Country of Origin
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AD8236ARMZ-R7 Parametric Info
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AD8236ARMZ-R7 Package Info
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AD8236ARMZ-R7 Manufacturing Info
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AD8236ARMZ-R7 Packaging Info
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AD8236ARMZ-R7 ECAD Models
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AD8236ARMZ-R7 APPLICATIONS |
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COUNTRY OF ORIGIN
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Malaysia
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PARAMETRIC INFO
|
Rail to Rail |
Rail to Rail Input/Output |
Number of Channels per Chip |
1 |
Maximum Input Offset Voltage (mV) |
3.5@5V |
Maximum Input Bias Current (uA) |
0.00001@5V |
Minimum CMRR (dB) |
86 |
Maximum Quiescent Current (mA) |
0.04@1.8V |
Minimum CMRR Range (dB) |
75 to 85 |
Minimum Single Supply Voltage (V) |
1.8 |
Maximum Single Supply Voltage (V) |
5.5 |
Maximum Input Resistance (MOhm) |
440000@5V |
Maximum Voltage Gain Range (dB) |
35 to 50 |
Maximum Voltage Gain (dB) |
46.02 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
125 |
Supplier Temperature Grade |
Industrial |
Power Supply Type |
Single |
Maximum Supply Voltage Range (V) |
<5 |
Typical Single Supply Voltage (V) |
3|5 |
Maximum Operating Supply Voltage (V) |
5.5 |
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PACKAGE INFO
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Supplier Package |
MSOP |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
8 |
Lead Shape |
Gull-wing |
PCB |
8 |
Tab |
N/R |
Pin Pitch (mm) |
0.65 |
Package Length (mm) |
3 |
Package Width (mm) |
3 |
Package Height (mm) |
0.85 |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
3 |
Package Overall Width (mm) |
4.9 |
Package Overall Height (mm) |
1.1(Max) |
Seated Plane Height (mm) |
1.1(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Micro Small Outline Package |
Package Family Name |
SO |
Jedec |
MO-187AA |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
|
MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Au |
Under Plating Material |
Pd over Ni |
Terminal Base Material |
Cu Alloy |
Number of Wave Cycles |
N/R |
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PACKAGING INFO
|
Packaging Suffix |
R7 |
Packaging |
Tape and Reel |
Quantity Of Packaging |
1000 |
Reel Diameter (in) |
7 |
Packaging Document |
Link to Datasheet |
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ECAD MODELS
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APPLICATIONS
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• Medical instrumentation
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• Low-side current sense
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• Portable devices
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