 |
|
| • Small package: 10-lead MSOP
|
| • Programmable gains: 1, 2, 4, 8 |
| • Digital or pin-programmable gain setting |
| • Wide supply: ±5 V to ±15 V |
• Excellent dc performance
- High CMRR: 98 dB (minimum), G = 8
- Low gain drift: 10 ppm/°C (maximum)
- Low offset drift: 1.8 μV/°C (maximum), G = 8 |
• Excellent ac performance
- Fast settling time: 785 ns to 0.001% (maximum)
- High slew rate: 20 V/μs (minimum)
- Low distortion: −110 dB THD at 1 kHz, 10 V swing
- High CMRR over frequency: 80 dB to 50 kHz (minimum)
- Low noise: 18 nV/√Hz, G = 8 (maximum)
- Low power: 4.1 mA |
|
| CATALOG |
| AD8251ARMZ-R7 COUNTRY OF ORIGIN |
| AD8251ARMZ-R7 PARAMETRIC INFO |
| AD8251ARMZ-R7 PACKAGE INFO |
| AD8251ARMZ-R7 MANUFACTURING INFO |
| AD8251ARMZ-R7 PACKAGING INFO |
| AD8251ARMZ-R7 ECAD MODELS |
| AD8251ARMZ-R7 FUNCTIONAL BLOCK DIAGRAM |
| AD8251ARMZ-R7 APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| Ireland |
| Malaysia |
|
| PARAMETRIC INFO |
| Number of Channels per Chip |
1 |
| Maximum Input Bias Current (uA) |
0.03@±15V |
| Minimum CMRR (dB) |
80 |
| Maximum Quiescent Current (mA) |
4.5@15V/-4.5@-15V |
| Process Technology |
CMOS |
| Minimum CMRR Range (dB) |
75 to 85 |
| Minimum Dual Supply Voltage (V) |
±5 |
| Maximum Dual Supply Voltage (V) |
±15 |
| Maximum Voltage Gain Range (dB) |
<35 |
| Maximum Voltage Gain (dB) |
18.06 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
125 |
| Power Supply Type |
Dual |
| Maximum Supply Voltage Range (V) |
30 to 50 |
| Typical Dual Supply Voltage (V) |
±9|±12 |
| Maximum Operating Supply Voltage (V) |
±15 |
|
| |
| PACKAGE INFO |
| Supplier Package |
MSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
10 |
| Lead Shape |
Gull-wing |
| PCB |
10 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
3 |
| Package Width (mm) |
3 |
| Package Height (mm) |
0.85 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3 |
| Package Overall Width (mm) |
4.9 |
| Package Overall Height (mm) |
1.1(Max) |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Micro Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-187BA |
| Package Outline |
Link to Datasheet |
|
| |
| MANUFACTURING INFO |
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
| |
| PACKAGING INFO |
| Packaging Suffix |
R7 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1000 |
| Reel Diameter (in) |
7 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
| Tape Material |
Plastic |
| Tape Type |
Embossed |
|
| |
| ECAD MODELS |
 |
|
| FUNCTIONAL BLOCK DIAGRAM |
 |
|
| APPLICATIONS |
| • Data acquisition |
| • Biomedical analysis |
| • Test and measurement |
|
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