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|
| • Small package: 10-lead MSOP |
| • Programmable gains: 1, 10, 100, 1000 |
| • Digital or pin-programmable gain setting |
| • Wide supply: ±5 V to ±15 V |
• Excellent dc performance
- High CMRR: 100 dB (minimum), G = 100
- Low gain drift: 10 ppm/°C (maximum)
- Low offset drift: 1.2 μV/°C (maximum), G = 1000 |
• Excellent ac performance
- Fast settling time: 780 ns to 0.001% (maximum)
- High slew rate: 20 V/μs (minimum)
- Low distortion: −110 dB THD at 1 kHz,10 V swing
- High CMRR over frequency: 100 dB to 20 kHz (minimum)
- Low noise: 10 nV/√Hz, G = 1000 (maximum)
Low power: 4 mA |
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| CATALOG |
| AD8253ARMZ-R7 COUNTRY OF ORIGIN |
| AD8253ARMZ-R7 PARAMETRIC INFO |
| AD8253ARMZ-R7 PACKAGE INFO |
| AD8253ARMZ-R7 MANUFACTURING INFO |
| AD8253ARMZ-R7 PACKAGING INFO |
| AD8253ARMZ-R7 ECAD MODELS |
| AD8253ARMZ-R7 FUNCTIONAL BLOCK DIAGRAM |
| AD8253ARMZ-R7 APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| Ireland |
| Malaysia |
|
| PARAMETRIC INFO |
| Number of Channels per Chip |
1 |
| Maximum Input Bias Current (uA) |
0.05@±15V |
| Minimum CMRR (dB) |
80 |
| Maximum Quiescent Current (mA) |
5.3@15V/-5.3@-15V |
| Minimum CMRR Range (dB) |
75 to 85 |
| Minimum Dual Supply Voltage (V) |
±5 |
| Maximum Input Resistance (MOhm) |
0.02(Typ)@±15V |
| Maximum Dual Supply Voltage (V) |
±15 |
| Maximum Voltage Gain Range (dB) |
60 to 75 |
| Maximum Voltage Gain (dB) |
60 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
125 |
| Power Supply Type |
Dual |
| Maximum Supply Voltage Range (V) |
30 to 50 |
| Typical Dual Supply Voltage (V) |
±9|±12 |
| Maximum Operating Supply Voltage (V) |
±15 |
|
| |
| PACKAGE INFO |
| Supplier Package |
MSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
10 |
| Lead Shape |
Gull-wing |
| PCB |
10 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
3 |
| Package Width (mm) |
3 |
| Package Height (mm) |
0.85 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3 |
| Package Overall Width (mm) |
4.9 |
| Package Overall Height (mm) |
1.1(Max) |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Micro Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-187BA |
| Package Outline |
Link to Datasheet |
|
| |
| MANUFACTURING INFO |
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
| |
| PACKAGING INFO |
| Packaging Suffix |
R7 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1000 |
| Reel Diameter (in) |
7 |
| Packaging Document |
Link to Datasheet |
|
| |
| ECAD MODELS |
 |
|
| FUNCTIONAL BLOCK DIAGRAM |
 |
|
| APPLICATIONS |
| • Data acquisition |
| • Biomedical analysis |
| • Test and measurement |
|
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