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• Complete RF detector/controller function
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• Frequency response from 100 MHz to 2.7 GHz
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• Rapid response: 70 ns to a 10 dB step
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• Low power: 12 mW at 2.7 V
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• Power down to 20 μA
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| CATALOG |
AD8314ARMZ-REEL7 COUNTRY OF ORIGIN
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AD8314ARMZ-REEL7 PARAMETRIC INFO
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AD8314ARMZ-REEL7 PACKAGE INFO
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AD8314ARMZ-REEL7 MANUFACTURING INFO
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AD8314ARMZ-REEL7 PACKAGING INFO
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AD8314ARMZ-REEL7 ECAD MODELS
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AD8314ARMZ-REEL7 APPLICATIONS
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|
COUNTRY OF ORIGIN
|
China
|
Taiwan (Province of China)
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|
PARAMETRIC INFO
|
| Type |
Logarithmic Amplifier |
| Number of Elements per Chip |
4 |
| Number of Channels per Chip |
1 |
| Maximum Quiescent Current (mA) |
5.7@3V |
| Typical Output Current (mA) |
6@3V |
| Maximum Input Resistance (MOhm) |
0.01(Typ)@3V |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Power Supply Type |
Single |
| Maximum Supply Voltage Range (V) |
5 to 7 |
| Minimum Single Supply Voltage (V) |
2.7 |
| Typical Single Supply Voltage (V) |
3 |
| Maximum Single Supply Voltage (V) |
5.5 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Maximum Power Dissipation (mW) |
200 |
|
|
PACKAGE INFO
|
| Supplier Package |
MSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
3 |
| Package Width (mm) |
3 |
| Package Height (mm) |
0.85 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3 |
| Package Overall Width (mm) |
4.9 |
| Package Overall Height (mm) |
1.1(Max) |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
0.4(Max) |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Micro Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-187AA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
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|
| PACKAGING INFO |
| Packaging Suffix |
REEL7 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1000 |
| Reel Diameter (in) |
7 |
| Packaging Document |
Link to Datasheet |
|
| |
| ECAD MODELS |
 |
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| APPLICATIONS |
| • Cellular handsets (TDMA, CDMA , GSM) |
| • RSSI and TSSI for wireless terminal devices |
| • Transmitter power measurement and control |
| |
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