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• Wide bandwidth: 1 MHz to 10 GHz
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• High accuracy: ±1.0 dB over temperature
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• 45 dB dynamic range up to 8 GHz
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• Stability over temperature: ±0.5 dB
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• Low noise measurement/controller output VOUT
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• Pulse response time (fall/rise): 6 ns/10 ns
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• Small footprint: 2 mm × 3 mm LFCSP
|
• Supply operation: 3.0 V to 5.5 V @ 22 mA
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• Fabricated using high speed SiGe process
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|
| CATALOG |
| AD8319ACPZ-R7 COUNTRY OF ORIGIN |
AD8319ACPZ-R7 PARAMETRIC INFO
|
AD8319ACPZ-R7 PACKAGE INFO
|
AD8319ACPZ-R7 MANUFACTURING INFO
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AD8319ACPZ-R7 PACKAGING INFO
|
AD8319ACPZ-R7 ECAD MODELS
|
AD8319ACPZ-R7 FUNCTIONAL BLOCK DIAGRAM
|
AD8319ACPZ-R7 APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
| USA |
Philippines
|
|
PARAMETRIC INFO
|
| Frequency Band (MHz) |
1 to 10000 |
| Minimum Operating Supply Voltage (V) |
3 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Maximum Input Power (dBm) |
12 |
| Maximum Power Dissipation (mW) |
730 |
| Accuracy (dB) |
±1 |
| Process Technology |
SiGe Bipolar |
| Typical Output Current (mA) |
10 |
| Maximum Output Voltage (V) |
1.34@-40dBm |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Thermal Resistance (°C/W) |
55 |
|
|
PACKAGE INFO
|
| Supplier Package |
LFCSP EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
No Lead |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
3 |
| Package Width (mm) |
2 |
| Package Height (mm) |
0.73 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3 |
| Package Overall Width (mm) |
2 |
| Package Overall Height (mm) |
0.75 |
| Seated Plane Height (mm) |
0.75 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Lead Frame Chip Scale Package, Exposed Pad |
| Package Family Name |
CSP |
| Jedec |
N/A |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R7 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Reel Diameter (in) |
7 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
| Tape Material |
Plastic |
| Tape Type |
Embossed |
|
|
ECAD MODELS
|
|
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FUNCTIONAL BLOCK DIAGRAM
|
|
|
APPLICATIONS
|
• RF transmitter PA setpoint controls and level monitoring
|
• Power monitoring in radiolink transmitters
|
• RSSI measurement in base stations, WLANs, WiMAX,
and radars
|
|
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