AD8513ARZ-REEL7 Analog Devices IC OPAMP JFET 8MHZ 14SOIC

label:
2023/08/24 385



• Fast settling time: 500 ns to 0.1%
• Low offset voltage: 400 μV maximum
• Low TCVOS: 1 μV/°C typical
• Low input bias current: 25 pA typical at VS = ±15 V
• Dual-supply operation: ±5 V to ±15 V
• Low noise: 8 nV/√Hz typical at f = 1 kHz
• Low distortion: 0.0005%
• No phase reversal
• Unity-gain stable


CATALOG
AD8513ARZ-REEL7 COUNTRY OF ORIGIN
AD8513ARZ-REEL7 PARAMETRIC INFO
AD8513ARZ-REEL7 PACKAGE INFO
AD8513ARZ-REEL7 MANUFACTURING INFO
AD8513ARZ-REEL7 PACKAGING INFO
AD8513ARZ-REEL7 ECAD MODELS
AD8513ARZ-REEL7 APPLICATIONS


COUNTRY OF ORIGIN
Philippines
United States of America


PARAMETRIC INFO
Manufacturer Type Low Noise Amplifier
Type Low Noise Amplifier
Rail to Rail No
Number of Channels per Chip 4
Minimum PSRR (dB) 86
Minimum Dual Supply Voltage (V) ±5
Typical Gain Bandwidth Product (MHz) 8
Maximum Input Offset Voltage (mV) 0.9@±5V
Typical Dual Supply Voltage (V) ±9|±12
Maximum Input Offset Current (uA) 0.00005@±5V
Maximum Dual Supply Voltage (V) ±15
Maximum Input Voltage Range (V) -2 to 2.5
Maximum Operating Supply Voltage (V) ±15
Maximum Input Bias Current (uA) 0.000075@±5V
Minimum CMRR (dB) 86
Maximum Supply Voltage Range (V) 30 to 32
Minimum CMRR Range (dB) 85 to 90
Typical Voltage Gain (dB) 100.59
Typical Slew Rate (V/us) 20@±5V
Typical Settling Time (ns) 400
Typical Output Current (mA) 54@±5V
Typical Input Noise Voltage Density (nV/rtHz) 34@±5V
Typical Input Bias Current (uA) 0.000021@±5V
Shut Down Support No
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Supplier Temperature Grade Extended Industrial
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Power Supply Type Dual
Maximum Supply Current (mA) 9.2@±5V
Typical High Level Output Voltage (V) 4.3
Typical Low Level Output Voltage (V) -4.9
Input Offset Voltage Drift (uV/°C) 12


PACKAGE INFO
Supplier Package SOIC N
Basic Package Type Lead-Frame SMT
Pin Count 14
Lead Shape Gull-wing
PCB 14
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 8.75(Max)
Package Width (mm) 4(Max)
Package Height (mm) 1.5(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 1.75(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline IC Narrow Body
Package Family Name SO
Jedec MS-012AB
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material Ag
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Suffix REEL7
Packaging Tape and Reel
Quantity Of Packaging 1000
Reel Diameter (in) 7
Tape Pitch (mm) 8
Tape Width (mm) 16
Component Orientation Q1
Packaging Document Link to Datasheet
Tape Material Plastic
Tape Type Embossed


ECAD MODELS



APPLICATIONS
• Instrumentation
• Multipole filters
• Precision current measurement
• Photodiode amplifiers
• Sensors
• Audio

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