AD8617ARZ-REEL Analog Devices IC OPAMP GP 400KHZ RRO 8SOIC

label:
2023/11/15 294



• Offset voltage: 2.2 mV maximum
• Low input bias current: 1 pA maximum
• Single-supply operation: 1.8 V to 5.5 V
• Low noise: 22 nV/√Hz
• Micropower: 50 μA/amplifier maximum over temperature
• No phase reversal
• Unity gain stable
• Qualified for automotive applications


CATALOG
AD8617ARZ-REEL COUNTRY OF ORIGIN
AD8617ARZ-REEL PARAMETRIC INFO
AD8617ARZ-REEL PACKAGE INFO
AD8617ARZ-REEL MANUFACTURING INFO
AD8617ARZ-REEL PACKAGING INFO
AD8617ARZ-REEL ECAD MODELS
AD8617ARZ-REEL APPLICATIONS


COUNTRY OF ORIGIN
Philippines
Taiwan (Province of China)


PARAMETRIC INFO
Manufacturer Type Low Noise Amplifier
Type Low Noise Amplifier
Rail to Rail Rail to Rail Input/Output
Minimum Single Supply Voltage (V) 1.8
Number of Channels per Chip 2
Process Technology CMOS
Minimum PSRR (dB) 67
Typical Single Supply Voltage (V) 3
Maximum Single Supply Voltage (V) 5
Output Type CMOS
Minimum Dual Supply Voltage (V) ±0.9
Typical Gain Bandwidth Product (MHz) 0.4
Maximum Input Offset Voltage (mV) 2.2@5V
Maximum Input Offset Current (uA) 0.0000005@5V
Maximum Dual Supply Voltage (V) ±2.5
Maximum Operating Supply Voltage (V) ±2.5|5
Maximum Input Bias Current (uA) 0.000001@5V
Minimum CMRR (dB) 95(Typ)
Maximum Supply Voltage Range (V) <5.5
Minimum CMRR Range (dB) 95 to 105
Typical Voltage Gain (dB) 113.98
Typical Slew Rate (V/us) 0.1@5V
Typical Settling Time (ns) 23000
Typical Input Noise Voltage Density (nV/rtHz) 25@5V
Typical Noninverting Input Current Noise Density (pA/rtHz) 0.05@5V
Typical Input Bias Current (uA) 0.0000002@5V
Shut Down Support No
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Power Supply Type Single|Dual
Maximum Supply Current (mA) 0.076(Typ)@5V


PACKAGE INFO
Supplier Package SOIC N
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 5(Max)
Package Width (mm) 4(Max)
Package Height (mm) 1.5(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 5(Max)
Package Overall Width (mm) 6.2(Max)
Package Overall Height (mm) 1.75(Max)
Seated Plane Height (mm) 1.75(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline IC Narrow Body
Package Family Name SO
Jedec MS-012AA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Maximum Wave Temperature (°C) 300
Wave Solder Time (Sec) 60
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material Ag
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Suffix REEL
Packaging Tape and Reel
Quantity Of Packaging 2500
Reel Diameter (in) 13
Tape Pitch (mm) 8
Tape Width (mm) 12
Component Orientation Q1
Packaging Document Link to Datasheet
Tape Material Plastic
Tape Type Embossed


ECAD MODELS



APPLICATIONS
• Battery-powered instrumentation
• Multipole filters
• Current shunt sense
• Sensors
• ADC predrivers
• DAC drivers/level shifters
• Low power ASIC input or output amplifiers
Продукт RFQ