|
|
• 10-Bit, 100 MSPS ADC
|
• Low Power: 450 mW at 100 MSPS
|
• On-Chip Track/Hold
|
• 280 MHz Analog Bandwidth
|
• SINAD = 54 dB @ 41 MHz
|
• On-Chip Reference
|
• 1 V p-p Analog Input Range
|
• Single 5 V Supply Operation
|
• 5 V/3.3 V Outputs
|
|
| CATALOG |
AD9071BR-REEL COUNTRY OF ORIGIN
|
| AD9071BR-REEL LIFECYCLE |
AD9071BR-REEL PARAMETRIC INFO
|
AD9071BR-REEL PACKAGE INFO
|
AD9071BR-REEL MANUFACTURING INFO
|
AD9071BR-REEL PACKAGING INFO
|
AD9071BR-REEL FUNCTIONAL BLOCK DIAGRAM
|
AD9071BR-REEL APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Malaysia
|
|
| LIFECYCLE |
Obsolete
May 28,2005 |
|
PARAMETRIC INFO
|
| Converter Type |
General Purpose |
| Input Type |
Voltage |
| Architecture |
Pipelined |
| Resolution |
10bit |
| Number of ADCs |
1 |
| Sampling Rate |
100Msps |
| Digital Interface Type |
Parallel |
| Voltage Reference |
Internal|External |
| Input Signal Type |
Single-Ended|Differential |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Integral Nonlinearity Error |
±1.75LSB |
| Signal to Noise Ratio |
56dB(Typ) |
| Sample and Hold |
Yes |
| Number of Input Channels |
1 |
| Single-Ended Input |
Yes |
| Differential Input |
Yes |
| Input Voltage |
±0.512Vp-p |
| Full Scale Error |
±8%FSR |
| Differential Nonlinearity |
±1.75LSB |
| Voltage Supply Source |
Single |
| Typical Single Supply Voltage (V) |
5 |
| Digital Supply Support |
No |
| Typical Power Dissipation (mW) |
450 |
| Maximum Power Dissipation (mW) |
620 |
|
|
PACKAGE INFO
|
| Supplier Package |
SOIC W |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
28 |
| Lead Shape |
Gull-wing |
| PCB |
28 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
18.1(Max) |
| Package Width (mm) |
7.6(Max) |
| Package Height (mm) |
2.35(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
2.65(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Small Outline IC Wide Body |
| Package Family Name |
SO |
| Jedec |
MS-013AE |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
N/A |
| Maximum Reflow Temperature (°C) |
235 |
| Reflow Solder Time (Sec) |
20 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
SnPb |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging Suffix |
REEL |
| Packaging |
Tape and Reel |
| Reel Diameter (in) |
13 |
| Packaging Document |
Link to Datasheet |
|
|
| FUNCTIONAL BLOCK DIAGRAM |
 |
|
| APPLICATIONS |
| • Digital Communications |
| • Signal Intelligence |
| • Digital Oscilloscopes |
| • Spectrum Analyzers |
| • Medical Imaging |
| • Sonar |
| • HDTV |
| |
One-stop supplier of IC products