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► Offset voltage:
► 25 µV maximum at 25°C (B grade, 8-lead SOIC, single/ dual)
► 50 µV maximum at 25°C (A grade, 8-lead SOIC, single/ dual)
► 50 µV maximum at 25°C (A grade, 14-lead SOIC, quad)
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► Offset voltage drift:
► 0.25 µV/°C maximum (B grade, 8-lead SOIC, single/dual)
► 0.55 µV/°C maximum (A grade, 8-lead SOIC, single/dual)
► 0.75 µV/°C maximum (A grade, 14-lead SOIC, quad) |
► MSL1 rated |
► Low input bias current: 1 nA maximum at TA = 25°C
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► Low voltage noise density: 6.9 nV/√Hz typical at f = 1000 Hz |
► CMRR, PSRR, and AV > 120 dB minimum |
► Low supply current: 400 µA per amplifier typical |
► Wide gain bandwidth product: 3.9 MHz at ±5 V |
► Dual-supply operation:
► Specified at ±5 V to ±15 V
► Operates at ±2.5 V to ±15 V |
► Unity gain stable |
► No phase reversal
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► Long-term offset voltage drift (10,000 hours): 0.5 µV typical
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► Temperature hysteresis: 1 µV typical |
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CATALOG |
ADA4077-2BRZ-R7 COUNTRY OF ORIGIN |
ADA4077-2BRZ-R7 PARAMETRIC INFO |
ADA4077-2BRZ-R7 PACKAGE INFO |
ADA4077-2BRZ-R7 MANUFACTURING INFO |
ADA4077-2BRZ-R7 PACKAGING INFO |
ADA4077-2BRZ-R7 ECAD MODELS |
ADA4077-2BRZ-R7 APPLICATIONS |
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COUNTRY OF ORIGIN |
Ireland |
Philippines |
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PARAMETRIC INFO |
Manufacturer Type |
Precision Amplifier |
Type |
Precision Amplifier |
Number of Channels per Chip |
2 |
Minimum PSRR (dB) |
123 |
Minimum Dual Supply Voltage (V) |
±2.5 |
Typical Gain Bandwidth Product (MHz) |
3.9 |
Maximum Input Offset Voltage (mV) |
0.05@±5V |
Typical Dual Supply Voltage (V) |
±3|±5|±9|±12 |
Maximum Input Offset Current (uA) |
0.0005@±5V |
Maximum Dual Supply Voltage (V) |
±15 |
Maximum Operating Supply Voltage (V) |
±15 |
Maximum Input Bias Current (uA) |
0.001@±5V |
Minimum CMRR (dB) |
122 |
Maximum Supply Voltage Range (V) |
30 to 32 |
Minimum CMRR Range (dB) |
>=115 |
Typical Voltage Gain (dB) |
130 |
Typical Slew Rate (V/us) |
1.2@±5V |
Typical Settling Time (ns) |
3000 |
Typical Output Current (mA) |
10@±5V |
Typical Input Noise Voltage Density (nV/rtHz) |
13@±5V |
Typical Noninverting Input Current Noise Density (pA/rtHz) |
0.2@±5V |
Shut Down Support |
No |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
125 |
Supplier Temperature Grade |
Extended Industrial |
Minimum Storage Temperature (°C) |
-65 |
Maximum Storage Temperature (°C) |
150 |
Power Supply Type |
Dual |
Maximum Supply Current (mA) |
0.9@±15V |
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PACKAGE INFO |
Supplier Package |
SOIC N |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
8 |
Lead Shape |
Gull-wing |
PCB |
8 |
Tab |
N/R |
Pin Pitch (mm) |
1.27 |
Package Length (mm) |
5(Max) |
Package Width (mm) |
4(Max) |
Package Height (mm) |
1.5(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
5(Max) |
Package Overall Width (mm) |
6.2(Max) |
Package Overall Height (mm) |
1.75(Max) |
Seated Plane Height (mm) |
1.75(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Small Outline IC Narrow Body |
Package Family Name |
SO |
Jedec |
MS-012AA |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO |
MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Maximum Wave Temperature (°C) |
300 |
Wave Solder Time (Sec) |
10 |
Wave Temp. Source |
Link to Datasheet |
Lead Finish(Plating) |
Matte Sn annealed |
Under Plating Material |
Ag |
Terminal Base Material |
Cu Alloy |
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PACKAGING INFO |
Packaging Suffix |
R7 |
Packaging |
Tape and Reel |
Quantity Of Packaging |
1000 |
Reel Diameter (in) |
7 |
Tape Pitch (mm) |
8 |
Tape Width (mm) |
12 |
Component Orientation |
Q1 |
Packaging Document |
Link to Datasheet |
Tape Material |
Plastic |
Tape Type |
Embossed |
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ECAD MODELS |
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APPLICATIONS |
► Process control front-end amplifiers |
► Optical network control circuits |
► Instrumentation |
► Precision sensors and controls |
► Precision filters |
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