|
|
• Low offset voltage: 50 µV maximum over specified CMRR range
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• Offset voltage drift: ±0.13 µV/°C typical, ±0.5 µV/°C maximum
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• Integrated guard buffer with 100 µV maximum offset
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• Low voltage noise density: 14 nV/√Hz at 10 kHz
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• Wide bandwidth: 2 MHz unity-gain crossover
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|
| CATALOG |
ADA4530-1ARZ-R7 COUNTRY OF ORIGIN
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ADA4530-1ARZ-R7 PARAMETRIC INFO
|
ADA4530-1ARZ-R7 PACKAGE INFO
|
ADA4530-1ARZ-R7 MANUFACTURING INFO
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ADA4530-1ARZ-R7 PACKAGING INFO
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ADA4530-1ARZ-R7 ECAD MODELS
|
ADA4530-1ARZ-R7 APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Taiwan (Province of China)
|
|
PARAMETRIC INFO
|
| Type |
Electrometer Amplifier |
| Rail to Rail |
Rail to Rail Output |
| Number of Elements per Chip |
1 |
| Number of Channels per Chip |
1 |
| Minimum PSRR (dB) |
130 |
| Output Type |
CMOS |
| Typical Gain Bandwidth Product (MHz) |
2 |
| Maximum Input Offset Voltage (mV) |
0.04@4.5V |
| Maximum Input Bias Current (uA) |
0.00000002@4.5V |
| Minimum CMRR (dB) |
73 |
| Minimum CMRR Range (dB) |
60 to 75 |
| Maximum Quiescent Current (mA) |
1.3@4.5V |
| Maximum Input Resistance (MOhm) |
100000000(Typ)@4.5V |
| Maximum Voltage Gain Range (dB) |
>=125 |
| Maximum Voltage Gain (dB) |
143 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Supplier Temperature Grade |
Industrial |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Power Supply Type |
Single|Dual |
| Maximum Supply Voltage Range (V) |
15 to 18 |
| Minimum Single Supply Voltage (V) |
4.5 |
| Typical Single Supply Voltage (V) |
5 |
| Maximum Single Supply Voltage (V) |
16 |
| Minimum Dual Supply Voltage (V) |
±2.25 |
| Typical Dual Supply Voltage (V) |
±2.5|±5 |
| Maximum Dual Supply Voltage (V) |
±8 |
| Maximum Operating Supply Voltage (V) |
±8|16 |
|
|
PACKAGE INFO
|
| Supplier Package |
SOIC N |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
4.9 |
| Package Width (mm) |
3.9 |
| Package Height (mm) |
1.38 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
4.9 |
| Package Overall Width (mm) |
6 |
| Package Overall Height (mm) |
1.55 |
| Seated Plane Height (mm) |
1.55 |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
0.41 |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC Narrow Body |
| Package Family Name |
SO |
| Jedec |
MS-012AA |
| Package Outline |
Link to Datasheet |
| Maximum PACKAGE_DIMENSION_H |
1.5 |
| Minimum PACKAGE_DIMENSION_H |
1.25 |
| Maximum PACKAGE_DIMENSION_L |
5 |
| Minimum PACKAGE_DIMENSION_L |
4.8 |
| Maximum PACKAGE_DIMENSION_W |
4 |
| Minimum PACKAGE_DIMENSION_W |
3.8 |
| Maximum Diameter |
N/R |
| Minimum Diameter |
N/R |
| Maximum Seated_Plane_Height |
1.75 |
| Minimum Seated_Plane_Height |
1.35 |
| Ball Array Length (mm) |
N/R |
| Ball Array Width (mm) |
N/R |
| Stand-off Height (mm) |
0.18 |
| Number of Column Balls |
N/R |
| Number of Row Balls |
N/R |
| Terminal Length (mm) |
0.84 |
| Terminal Thickness (mm) |
0.21 |
| Bottom Pad Length (mm) |
N/R |
| Bottom Pad Width (mm) |
N/R |
| Bottom Pad Chamfer |
N/R |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R7 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1000 |
| Reel Diameter (in) |
7 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
| Tape Material |
Plastic |
| Tape Type |
Embossed |
|
|
| ECAD MODELS |
 |
|
| APPLICATIONS |
| • Laboratory and analytical instrumentation: spectrophoto-meters,chromatographs, mass spectrometers, and potentiostatic and amperostatic coulometry |
| • Instrumentation: picoammeters and coulombmeters |
| • Transimpedance amplifier (TIA) for photodiodes, ion chambers,and working electrode measurements |
| • High impedance buffering for chemical sensors and capacitive sensors |
| |
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