ADC128S102CIMTX/NOPB Texas Instruments IC ADC 12BIT 8CH 0.5-1M 16TSSOP

label:
2023/11/29 314


• Eight Input Channels
• Variable Power Management
• Independent Analog and Digital Supplies
• SPI/QSPI™ /MICROWIRE™/DSP Compatible  
• Packaged in 16-Lead TSSOP
• Key Specifications
   – Conversion Rate 500 ksps to 1 MSPS
   – DNL (VA = VD = 5.0 V) +1.5 / −0.9
   – LSB (maximum) INLL (VA = VD = 5.0 V) ±1.2 LSB (maximum)
   – Power Consumption
      – 3V Supply 2.3 mW (typical)
      – 5V Supply 10.7 mW (typical)   


CATALOG
ADC128S102CIMTX/NOPB COUNTRY OF ORIGIN
ADC128S102CIMTX/NOPB PARAMETRIC INFO
ADC128S102CIMTX/NOPB PACKAGE INFO
ADC128S102CIMTX/NOPB MANUFACTURING INFO
ADC128S102CIMTX/NOPB PACKAGING INFO
ADC128S102CIMTX/NOPB ECAD MODELS
ADC128S102CIMTX/NOPB FUNCTIONAL BLOCK DIAGRAM
ADC128S102CIMTX/NOPB APPLICATIONS


COUNTRY OF ORIGIN
China
Malaysia


PARAMETRIC INFO
Converter Type General Purpose
Input Type Voltage
Architecture SAR
Resolution 12bit
Number of ADCs 1
Sampling Rate 1Msps
Digital Interface Type Serial (SPI, QSPI, Microwire)
Voltage Reference Supply
Minimum Positive Supply Voltage (V) 2.7
Maximum Positive Supply Voltage (V) 5.25
Input Signal Type Single-Ended
Process Technology CMOS
Polarity of Input Voltage Unipolar
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 105
Supplier Temperature Grade Extended Industrial
Integral Nonlinearity Error ±1.2LSB
Signal to Noise Ratio 73dB(Typ)
Sample and Hold Yes
Number of Input Channels 8
Single-Ended Input Yes
Differential Input No
Input Voltage 5.25V
No Missing Codes (bit) 12
Full Scale Error ±2LSB
Differential Nonlinearity -0.9/1.5LSB
Voltage Supply Source Single
Minimum Single Supply Voltage (V) 2.7
Typical Single Supply Voltage (V) 3.3|5
Maximum Single Supply Voltage (V) 5.25
Digital Supply Support No
Maximum Power Dissipation (mW) 1200
 
PACKAGE INFO
Supplier Package TSSOP
Basic Package Type Lead-Frame SMT
Pin Count 16
Lead Shape Gull-wing
PCB 16
Tab N/R
Pin Pitch (mm) 0.65
Package Length (mm) 5.1(Max)
Package Width (mm) 4.5(Max)
Package Height (mm) 1.05(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 5.1(Max)
Package Overall Width (mm) 6.6(Max)
Package Overall Height (mm) 1.2(Max)
Seated Plane Height (mm) 1.2(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Thin Shrink Small Outline Package
Package Family Name SO
Jedec MO-153AB
Package Outline Link to Datasheet
 
MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn
Under Plating Material N/A
Terminal Base Material Cu Alloy
 
PACKAGING INFO
Packaging Suffix X
Packaging Tape and Reel
Quantity Of Packaging 2500
 
ECAD MODELS


FUNCTIONAL BLOCK DIAGRAM


APPLICATIONS
• Automotive Navigation
• Portable Systems
• Medical Instruments
• Mobile Communications
• Instrumentation and Control Systems


Продукт RFQ