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• Eight Input Channels |
• Variable Power Management |
• Independent Analog and Digital Supplies |
• SPI/QSPI™ /MICROWIRE™/DSP Compatible
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• Packaged in 16-Lead TSSOP |
• Key Specifications
– Conversion Rate 500 ksps to 1 MSPS
– DNL (VA = VD = 5.0 V) +1.5 / −0.9
– LSB (maximum) INLL (VA = VD = 5.0 V) ±1.2 LSB (maximum)
– Power Consumption
– 3V Supply 2.3 mW (typical)
– 5V Supply 10.7 mW (typical)
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CATALOG |
ADC128S102CIMTX/NOPB COUNTRY OF ORIGIN |
ADC128S102CIMTX/NOPB PARAMETRIC INFO |
ADC128S102CIMTX/NOPB PACKAGE INFO |
ADC128S102CIMTX/NOPB MANUFACTURING INFO |
ADC128S102CIMTX/NOPB PACKAGING INFO |
ADC128S102CIMTX/NOPB ECAD MODELS |
ADC128S102CIMTX/NOPB FUNCTIONAL BLOCK DIAGRAM |
ADC128S102CIMTX/NOPB APPLICATIONS |
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COUNTRY OF ORIGIN |
China |
Malaysia |
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PARAMETRIC INFO |
Converter Type |
General Purpose |
Input Type |
Voltage |
Architecture |
SAR |
Resolution |
12bit |
Number of ADCs |
1 |
Sampling Rate |
1Msps |
Digital Interface Type |
Serial (SPI, QSPI, Microwire) |
Voltage Reference |
Supply |
Minimum Positive Supply Voltage (V) |
2.7 |
Maximum Positive Supply Voltage (V) |
5.25 |
Input Signal Type |
Single-Ended |
Process Technology |
CMOS |
Polarity of Input Voltage |
Unipolar |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
105 |
Supplier Temperature Grade |
Extended Industrial |
Integral Nonlinearity Error |
±1.2LSB |
Signal to Noise Ratio |
73dB(Typ) |
Sample and Hold |
Yes |
Number of Input Channels |
8 |
Single-Ended Input |
Yes |
Differential Input |
No |
Input Voltage |
5.25V |
No Missing Codes (bit) |
12 |
Full Scale Error |
±2LSB |
Differential Nonlinearity |
-0.9/1.5LSB |
Voltage Supply Source |
Single |
Minimum Single Supply Voltage (V) |
2.7 |
Typical Single Supply Voltage (V) |
3.3|5 |
Maximum Single Supply Voltage (V) |
5.25 |
Digital Supply Support |
No |
Maximum Power Dissipation (mW) |
1200 |
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PACKAGE INFO |
Supplier Package |
TSSOP |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
16 |
Lead Shape |
Gull-wing |
PCB |
16 |
Tab |
N/R |
Pin Pitch (mm) |
0.65 |
Package Length (mm) |
5.1(Max) |
Package Width (mm) |
4.5(Max) |
Package Height (mm) |
1.05(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
5.1(Max) |
Package Overall Width (mm) |
6.6(Max) |
Package Overall Height (mm) |
1.2(Max) |
Seated Plane Height (mm) |
1.2(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Thin Shrink Small Outline Package |
Package Family Name |
SO |
Jedec |
MO-153AB |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO |
MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Matte Sn |
Under Plating Material |
N/A |
Terminal Base Material |
Cu Alloy |
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PACKAGING INFO |
Packaging Suffix |
X |
Packaging |
Tape and Reel |
Quantity Of Packaging |
2500 |
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ECAD MODELS |
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FUNCTIONAL BLOCK DIAGRAM |
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APPLICATIONS |
• Automotive Navigation |
• Portable Systems |
• Medical Instruments |
• Mobile Communications |
• Instrumentation and Control Systems |
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