|
|
• Output frequency range: 137.5 MHz to 4400 MHz
|
• Fractional-N synthesizer and integer-N synthesizer
|
• Low phase noise VCO
|
• Programmable divide-by-1/-2/-4/-8/-16 output
|
• Typical rms jitter: <0.4 ps rms
|
• Power supply: 3.0 V to 3.6 V
|
• Logic compatibility: 1.8 V
|
|
| CATALOG |
ADF4350BCPZ-RL7 COUNTRY OF ORIGIN
|
ADF4350BCPZ-RL7 PARAMETRIC INFO
|
ADF4350BCPZ-RL7 PACKAGE INFO
|
ADF4350BCPZ-RL7 MANUFACTURING INFO
|
ADF4350BCPZ-RL7 PACKAGING INFO
|
ADF4350BCPZ-RL7 ECAD MODELS
|
ADF4350BCPZ-RL7 APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Korea (Republic of)
|
|
PARAMETRIC INFO
|
| Number of Outputs per Chip |
4 |
| Clock Input Frequency (MHz) |
10 to 250 |
| Maximum Output Frequency (MHz) |
4400 |
| Input Logic Level |
CMOS|TTL |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Internal/External Clock Type |
VCO |
| Input Signal Type |
Single-Ended |
| Output Signal Type |
Differential |
| Hitless Protection Switching |
No |
| Frequency Margining |
No |
| Programmability |
Yes |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
125 |
| Minimum Operating Supply Voltage (V) |
3 |
| Typical Operating Supply Voltage (V) |
3.3 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Number of Clock Inputs |
1 |
| Spread Spectrum |
No |
| Maximum Supply Current (mA) |
27 |
|
|
PACKAGE INFO
|
| Supplier Package |
LFCSP EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
32 |
| Lead Shape |
No Lead |
| PCB |
32 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
5 |
| Package Width (mm) |
5 |
| Package Height (mm) |
0.83 |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
0.85 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Lead Frame Chip Scale Package, Exposed Pad |
| Package Family Name |
CSP |
| Jedec |
MO-220VHHD-2 |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
40 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging Suffix |
RL7 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1500 |
| Reel Diameter (in) |
7 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
 |
| |
| APPLICATIONS |
| • Wireless infrastructure (W-CDMA, TD-SCDMA, WiMAX,GSM, PCS, DCS, DECT) |
| • Test equipment |
| • Wireless LANs, CATV equipment |
| • Clock generation |
| |
One-stop supplier of IC products