|
|
• SPI interface
|
• Supports daisy-chain mode
|
• 9.5 Ω on resistance at 25°C and ±15 V dual supply
|
• 1.6 Ω on-resistance flatness at 25°C and ±15 V dual supply
|
• Fully specified at ±15 V, +12 V, ±5 V
|
• 3 V logic-compatible inputs
|
• Rail-to-rail operation
|
• 24-lead TSSOP and 24-lead, 4 mm × 4 mm LFCSP
|
|
| CATALOG |
ADG1414BRUZ-REEL7 COUNTRY OF ORIGIN
|
ADG1414BRUZ-REEL7 PARAMETRIC INFO
|
ADG1414BRUZ-REEL7 PACKAGE INFO
|
ADG1414BRUZ-REEL7 MANUFACTURING INFO
|
ADG1414BRUZ-REEL7 PACKAGING INFO
|
ADG1414BRUZ-REEL7 ECAD MODELS
|
ADG1414BRUZ-REEL7 FUNCTIONAL BLOCK DIAGRAM
|
ADG1414BRUZ-REEL7 APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Taiwan (Province of China)
|
|
PARAMETRIC INFO
|
| Type |
Analog Switch |
| Number of Channels per Chip |
8 |
| Switch Architecture |
SPST |
| Polarity |
Non-Inverting |
| Maximum On Resistance Range (Ohm) |
25 to 35 |
| Configuration |
Octal SPST |
| Number of Inputs per Chip |
8 |
| Function |
General |
| Number of Outputs per Chip |
8 |
| Chip Enable Signals |
Yes |
| Maximum On Resistance (Ohm) |
25@±5V |
| Maximum Turn-On Time (ns) |
250@±5V |
| Maximum Turn-Off Time (ns) |
60@±5V |
| Input Signal Type |
Single |
| Output Signal Type |
Single |
| Maximum Frequency (25°C) @ Vcc (MHz) |
256(Typ)@±5V|240(Typ)@12V |
| Switch Control Logic |
Active High |
| Switch Normal Position |
NO |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Supplier Temperature Grade |
Industrial |
| Power Supply Type |
Single|Dual |
| Minimum Single Supply Voltage (V) |
4.5 |
| Typical Single Supply Voltage (V) |
12 |
| Maximum Single Supply Voltage (V) |
16.5 |
| Minimum Dual Supply Voltage (V) |
±4.5 |
| Typical Dual Supply Voltage (V) |
±5|±15 |
| Maximum Dual Supply Voltage (V) |
±16.5 |
| Typical Supply Current (mA) |
±0.000001@±5.5V |
| Maximum Supply Current (mA) |
±0.001@±5.5V@-40C to 125C |
|
|
PACKAGE INFO
|
| Supplier Package |
TSSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
24 |
| Lead Shape |
Gull-wing |
| PCB |
24 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
7.8 |
| Package Width (mm) |
4.4 |
| Package Height (mm) |
1.05(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1.2(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Thin Shrink Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-153AD |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging Suffix |
REEL7 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1000 |
| Reel Diameter (in) |
7 |
| Packaging Document |
Link to Datasheet |
|
|
| ECAD MODELS |
|
|
FUNCTIONAL BLOCK DIAGRAM
|
 |
|
| APPLICATIONS |
| • Automatic test equipment |
| • Data acquisition systems |
| • Battery-powered systems |
| • Sample-and-hold systems |
| • Audio signal routing |
| • Video signal routing |
| • Communication systems |
| |
One-stop supplier of IC products