|
|
• Output frequency range: 400 MHz to 6 GHz
|
• 1 dB output compression: ≥9.4 dBm from 450 MHz to 4 GHz
|
• Output return loss ≤ 12 dB from 450 MHz to 4.5 GHz
|
• Noise floor: −160 dBm/Hz at 900 MHz
|
• Sideband suppression: ≤−50 dBc at 900 MHz
|
|
| CATALOG |
ADL5375-05ACPZ-R7 COUNTRY OF ORIGIN
|
ADL5375-05ACPZ-R7 PARAMETRIC INFO
|
ADL5375-05ACPZ-R7 PACKAGE INFO
|
ADL5375-05ACPZ-R7 MANUFACTURING INFO
|
ADL5375-05ACPZ-R7 PACKAGING INFO
|
ADL5375-05ACPZ-R7 ECAD MODELS
|
ADL5375-05ACPZ-R7 APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Korea (Republic of)
|
|
PARAMETRIC INFO
|
| Device Type |
Modulator |
| Modulation Type |
Quadrature |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Typical Operating Supply Voltage (V) |
5 |
| Minimum Operating Supply Voltage (V) |
4.75 |
| Maximum Operating Supply Voltage (V) |
5.25 |
| Operating Supply Voltage (V) |
5 |
| Maximum Modulation Error |
2.52°(Typ) |
| Maximum Supply Current (A) |
200(Typ) |
| Typical Output Power (dBm) |
0.87 |
| Maximum Power Dissipation (mW) |
1500 |
| Programmability |
No |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
LFCSP EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
24 |
| Lead Shape |
No Lead |
| PCB |
24 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
4 |
| Package Width (mm) |
4 |
| Package Height (mm) |
0.73 |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
0.75 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Lead Frame Chip Scale Package, Exposed Pad |
| Package Family Name |
CSP |
| Jedec |
MO-243VGGD |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R7 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1500 |
| Reel Diameter (in) |
7 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
|
| APPLICATIONS |
| • Cellular communication systems GSM/EDGE, CDMA2000, W-CDMA, TD-SCDMA |
| • WiMAX/LTE broadband wireless access systems |
| • Satellite modems |
| |
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