|
|
• Operating RF and LO frequency: 400 MHz to 6 GHz
|
• Input IP3
30 dBm at 900 MHz
28 dBm at 1900 MHz
|
• Input IP2: >65 dBm at 900 MHz
|
• Input P1dB (IP1dB): 11.6 dBm at 900 MHz
|
• Noise figure (NF)
10.9 dB at 900 MHz
11.7 dB at 1900 MHz
|
• Voltage conversion gain: ~7 dB
|
• Quadrature demodulation accuracy at 900 MHz
Phase accuracy: ~0.2°
Amplitude balance: ~0.07 dB
|
• Demodulation bandwidth: ~390 MHz
|
• Baseband I/Q drive: 2 V p-p into 200 Ω
|
• Single 5 V supply
|
|
| CATALOG |
| ADL5380ACPZ-R7 COUNTRY OF ORIGIN |
ADL5380ACPZ-R7 PARAMETRIC INFO
|
ADL5380ACPZ-R7 PACKAGE INFO
|
ADL5380ACPZ-R7 MANUFACTURING INFO
|
ADL5380ACPZ-R7 PACKAGING INFO
|
ADL5380ACPZ-R7 ECAD MODELS
|
ADL5380ACPZ-R7 FUNCTIONAL BLOCK DIAGRAM
|
ADL5380ACPZ-R7 APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
| USA |
Korea (Republic of)
|
Philippines
|
|
PARAMETRIC INFO
|
| Device Type |
Demodulator |
| Modulation Type |
Quadrature |
| Maximum I/Q Frequency (MHz) |
6000 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Process Technology |
Bipolar |
| Typical Operating Supply Voltage (V) |
5 |
| Minimum Operating Supply Voltage (V) |
4.75 |
| Maximum Operating Supply Voltage (V) |
5.25 |
| Operating Supply Voltage (V) |
4.75 to 5.25 |
| Maximum Conversion Gain (dB) |
7.4(Typ) |
| Typical Noise Figure (dB) |
15.5 |
| Maximum Supply Current (A) |
245(Typ) |
| Maximum Power Dissipation (mW) |
1370 |
| Programmability |
No |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
125 |
|
|
PACKAGE INFO
|
| Supplier Package |
LFCSP EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
24 |
| Lead Shape |
No Lead |
| PCB |
24 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
4 |
| Package Width (mm) |
4 |
| Package Height (mm) |
0.73 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
4 |
| Package Overall Width (mm) |
4 |
| Package Overall Height (mm) |
0.75 |
| Seated Plane Height (mm) |
0.75 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Lead Frame Chip Scale Package, Exposed Pad |
| Package Family Name |
CSP |
| Jedec |
MO-220-WGGD |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R7 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1500 |
| Reel Diameter (in) |
7 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q2 |
| Packaging Document |
Link to Datasheet |
| Tape Material |
Plastic |
| Tape Type |
Embossed |
|
|
ECAD MODELS
|
|
|
FUNCTIONAL BLOCK DIAGRAM
|
|
|
APPLICATIONS
|
• Cellular W-CDMA/GSM/LTE
|
• Microwave point-to-(multi)point radios
|
• Broadband wireless and WiMAX
|
|
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