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• Operating RF and LO frequency: 700 MHz to 2.7 GHz
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• Input IP2: >70 dBm @ 900 MHz
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• Input P1dB: 14.7 dBm @ 900 MHz
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• Voltage conversion gain: ~4 dB
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• Demodulation bandwidth: ~370 MHz
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• Baseband I/Q drive: 2 V p-p into 200 Ω
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• Single 5 V supply
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|
| CATALOG |
ADL5382ACPZ-R7 COUNTRY OF ORIGIN
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ADL5382ACPZ-R7 PARAMETRIC INFO
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ADL5382ACPZ-R7 PACKAGE INFO
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ADL5382ACPZ-R7 MANUFACTURING INFO
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ADL5382ACPZ-R7 PACKAGING INFO
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ADL5382ACPZ-R7 ECAD MODELS
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ADL5382ACPZ-R7 APPLICATIONS
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|
COUNTRY OF ORIGIN
|
Korea (Republic of)
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|
PARAMETRIC INFO
|
| Device Type |
Demodulator |
| Modulation Type |
Quadrature |
| Maximum I/Q Frequency (MHz) |
370(Typ) |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Process Technology |
Silicon Germanium Bipolar |
| Typical Operating Supply Voltage (V) |
5 |
| Minimum Operating Supply Voltage (V) |
4.75 |
| Maximum Operating Supply Voltage (V) |
5.25 |
| Operating Supply Voltage (V) |
5 |
| Maximum Conversion Gain (dB) |
3.9(Typ) |
| Typical Noise Figure (dB) |
17.6 |
| Maximum Supply Current (A) |
220(Typ) |
| Maximum Power Dissipation (mW) |
1230 |
| Programmability |
No |
|
|
PACKAGE INFO
|
| Supplier Package |
LFCSP EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
24 |
| Lead Shape |
No Lead |
| PCB |
24 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
4 |
| Package Width (mm) |
4 |
| Package Height (mm) |
0.83 |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
0.85 |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Lead Frame Chip Scale Package, Exposed Pad |
| Package Family Name |
CSP |
| Jedec |
MO-220VGGD-2 |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R7 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1500 |
| Reel Diameter (in) |
7 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
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APPLICATIONS
|
• Cellular W-CDMA/CDMA/CDMA2000/GSM
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• Microwave point-to-(multi)point radios
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| • Broadband wireless and WiMAX |
| |
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