ADL5611ARKZ-R7 Analog Devices IC AMP W-CDMA 30MHZ-6GHZ SOT89-3

label:
2025/09/15 30
ADL5611ARKZ-R7 Analog Devices IC AMP W-CDMA 30MHZ-6GHZ SOT89-3


• Fixed gain of 22.2 dB
• Broad operation from 30 MHz to 6 GHz
• High dynamic range gain block
• Input and output internally matched to 50 Ω
• Integrated bias circuit


CATALOG
ADL5611ARKZ-R7 COUNTRY OF ORIGIN
ADL5611ARKZ-R7 PARAMETRIC INFO
ADL5611ARKZ-R7 PACKAGE INFO
ADL5611ARKZ-R7 MANUFACTURING INFO
ADL5611ARKZ-R7 PACKAGING INFO
ADL5611ARKZ-R7 ECAD MODELS


COUNTRY OF ORIGIN
Philippines


PARAMETRIC INFO
Manufacturer Type Gain Amplifier
Number of Channels per Chip 1
Typical Power Gain (dB) 14.3@5800MHz
Typical Noise Figure (dB) 6@5800MHz
Operational Bias Conditions 5V/94mA
Typical Output 1dB Compressed Power @ Bias Conditions (dBm) 12.8
Typical 3rd Order Output Intercept Point @ Bias Conditions (dBm) 23
Typical Output Intercept Point (dBm) 23@5800MHz
Minimum Operating Frequency (MHz) 30
Maximum Power Dissipation (mW) 800
Maximum Operating Frequency (MHz) 6000
Typical Output Power (dBm) 12.8@5800MHz
Typical Output Power Range (dBm) 20 to 30
Power Supply Type Single
Minimum Single Supply Voltage (V) 4.75
Typical Single Supply Voltage (V) 5
Maximum Single Supply Voltage (V) 5.25
Maximum Operating Supply Voltage (V) 5.25
Maximum Supply Current (mA) 124@5V
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 105
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package SOT-89
Basic Package Type Lead-Frame SMT
Pin Count 4
Lead Shape Flat
PCB 3
Tab Tab
Pin Pitch (mm) 1.5
Package Length (mm) 4.6(Max)
Package Width (mm) 2.6(Max)
Package Height (mm) 1.6(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 1.6(Max)
Mounting Surface Mount
Terminal Width (mm) 0.52(Max)|0.56(Max)|1.75(Max)
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline Transistor
Package Family Name SOT
Jedec TO-243AA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material Ag
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Suffix R7
Packaging Tape and Reel
Quantity Of Packaging 1000
Reel Diameter (in) 7
Tape Pitch (mm) 8
Tape Width (mm) 12
Component Orientation Q1
Packaging Document Link to Datasheet
Tape Material Plastic
Tape Type Embossed


ECAD MODELS
Продукт RFQ