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• 5 kV rms isolated RS-485/RS-422 transceiver, configurable as half or full duplex
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• isoPower integrated isolated dc-to-dc converter
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• ±15 kV ESD protection on RS-485 input/output pins
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| • Complies with ANSI/TIA/EIA-485-A-98 and ISO 8482:1987(E) |
| • Data rate: 16 Mbps (ADM2682E), 500 kbps (ADM2687E) |
| • 5 V or 3.3 V operation |
| • Connect up to 256 nodes on one bus |
| • Open- and short-circuit, fail-safe receiver inputs |
| • High common-mode transient immunity: >25 kV/µs |
| • Thermal shutdown protection |
| • Safety and regulatory approvals UL recognition 5000 V rms for 1 minute per UL 1577 CSA Component Acceptance Notice #5A (pending) IEC 60601-1: 400 V rms (basic), 250 V rms (reinforced)IEC 60950-1: 600 V rms (basic), 380 V rms (reinforced)VDE Certificates of Conformity DIN V VDE V 0884-10 (VDE V 0884-10): 2006-12 VIORM = 846 V peak |
| • Operating temperature range: −40°C to +85°C |
| • 16-lead wide-body SOIC with >8 mm creepage and clearance |
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| CATALOG |
| ADM2682EBRIZ-RL7 COUNTRY OF ORIGIN |
ADM2682EBRIZ-RL7 PARAMETRIC INFO
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ADM2682EBRIZ-RL7 PACKAGE INFO
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ADM2682EBRIZ-RL7 MANUFACTURING INFO
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ADM2682EBRIZ-RL7 PACKAGING INFO
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ADM2682EBRIZ-RL7 EACD MODELS
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| ADM2682EBRIZ-RL7 APPLICATIONS |
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| COUNTRY OF ORIGIN |
| Taiwan (Province of China) |
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PARAMETRIC INFO
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| Type |
Synchronous Step Down |
| Number of Outputs |
1 |
| Minimum Input Voltage (V) |
3.5 |
| Maximum Input Voltage (V) |
60 |
| Output Voltage (V) |
0.8 to 58 |
| Maximum Output Current (A) |
2.5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Supplier Temperature Grade |
Automotive |
| Switching Frequency (kHz) |
1000 to 2500 |
| Switching Regulator |
Yes |
| Output Type |
Adjustable |
| Typical Quiescent Current (uA) |
138 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Typical Switch Current (A) |
6.1 |
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PACKAGE INFO
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| Supplier Package |
HVSSOP EP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
10 |
| Lead Shape |
Gull-wing |
| PCB |
10 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
3.1(Max) |
| Package Width (mm) |
3.1(Max) |
| Package Height (mm) |
0.95(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.1(Max) |
| Package Overall Width (mm) |
5.05(Max) |
| Package Overall Height (mm) |
1.1(Max) |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Heat Sinked Very Thin Shrink Small Outline Package, Exposed Pad |
| Package Family Name |
SO |
| Jedec |
MO-187BA-T |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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| APPLICATIONS |
| • Isolated RS-485/RS-422 interfaces
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| • Industrial field networks |
| • Multipoint data transmission systems |
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