ADM3202ARNZ-REEL Analog Devices IC TXRX DUAL RS-232 3.3V 16SOIC

label:
2023/11/9 336



• 460 kbps data rate
• Specified at 3.3 V
• Meets EIA-232E specifications
• 0.1 μF charge pump capacitors
• Low power shutdown (ADM3222 and ADM1385)
• PDIP, SOIC_N, SOIC_W, SSOP, and TSSOP options
• Upgrade for MAX3222/MAX3232 and LTC1385
• ESD protection to IEC 1000-4-2 (801.2) on RS-232 pins (ADM3202 only)
• ±8 kV: contact discharge
• ±15 kV: air gap discharge


CATALOG
ADM3202ARNZ-REEL COUNTRY OF ORIGIN
ADM3202ARNZ-REEL PARAMETRIC INFO
ADM3202ARNZ-REEL PACKAGE INFO
ADM3202ARNZ-REEL MANUFACTURING INFO
ADM3202ARNZ-REEL PACKAGING INFO
ADM3202ARNZ-REEL ECAD MODELS
ADM3202ARNZ-REEL FUNCTIONAL BLOCK DIAGRAM
ADM3202ARNZ-REEL APPLICATIONS


COUNTRY OF ORIGIN
Malaysia
Taiwan (Province of China)


PARAMETRIC INFO
Function Line Transceiver
Number of Transceivers 1
Number of Transmitters 2
Number of Receivers 2
Data Transmission Topology Point-to-Point
Transmitter Signal Type Single-Ended
Receiver Signal Type Single-Ended
Transmitter Communication Type RS-232
Charge Pump Yes
Input Logic Level CMOS
Output Logic Level CMOS
Receiver Communication Type RS-232
Power Down Mode Shutdown
Typical Shutdown Current (uA) 0.0001
Fail Safe Open/Short
Interface Standards EIA/TIA-232-E|RS-232|V.28
Number of Transmitter Enables 0
Number of Receiver Enables 0
Number of Drivers per Line 1
Number of Receivers per Line 1
Data Rate 460Kbps(Min)
Driving Mode 3-State
Process Technology CMOS
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65
Power Supply Type Single
Typical Single Supply Voltage (V) 3.3
Minimum Single Supply Voltage (V) 3
Maximum Single Supply Voltage (V) 5.5
Maximum Supply Current (mA) 12
Isolation No


PACKAGE INFO
Supplier Package SOIC N
Basic Package Type Lead-Frame SMT
Pin Count 16
Lead Shape Gull-wing
PCB 16
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 10(Max)
Package Width (mm) 4(Max)
Package Height (mm) 1.5(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 10(Max)
Package Overall Width (mm) 6.2(Max)
Package Overall Height (mm) 1.75(Max)
Seated Plane Height (mm) 1.75(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline IC Narrow Body
Package Family Name SO
Jedec MS-012AC
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material Ag
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Tray
Quantity Of Packaging 260
Packaging Document Link to Datasheet


ECAD MODELS



FUNCTIONAL BLOCK DIAGRAM



APPLICATIONS
• General-purpose RS-232 data link
• Portable instruments
• Printers, palmtop computers, PDAs
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