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• Up to 400 positions in a 4-row design
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• 5 mm, 7 mm, 9 mm, 10 mm, 11 mm, 12 mm 14 mm & 16 mm stack heights
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• Slim 5 mm width body design
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• Edge Rate® contact system optimized for signal integrity performance
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• Open-pin-field for grounding and routing flexibility
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• Supports 64 Gbps PAM4 (32 Gbps NRZ) applications
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CATALOG |
ADM6-60-01.5-L-4-2-A-TR COUNTRY OF ORIGIN
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ADM6-60-01.5-L-4-2-A-TR PARAMETRIC INFO
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ADM6-60-01.5-L-4-2-A-TR PACKAGE INFO
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ADM6-60-01.5-L-4-2-A-TR MANUFACTURING INFO
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ADM6-60-01.5-L-4-2-A-TR PACKAGING INFO
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ADM6-60-01.5-L-4-2-A-TR ECAD MODELS
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COUNTRY OF ORIGIN
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China
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United States of America
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Taiwan (Province of China)
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Costa Rica
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Viet Nam
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Singapore
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Malaysia
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PARAMETRIC INFO
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Type |
Open Pin Field Array |
Gender |
HDR |
Number of Contacts |
240 |
Termination Method |
Solder |
Tradename |
Accelerate® |
Maximum Current Rating (A) |
1.34/Contact |
Maximum Voltage Rating |
219VDC|155VAC |
Housing Material |
Liquid Crystal Polymer |
Housing Color |
Black |
Contact Material |
Copper Alloy |
Contact Plating |
Gold Over Nickel |
Number of Rows |
4 |
Maximum Contact Resistance (mOhm) |
15 |
Polarization Type |
Dual Key |
Insulation Resistance (MOhm) |
45000 |
Speed Rating (Gbps) |
64 |
Operating Temperature (°C) |
-55 to 125 |
Minimum Operating Temperature (°C) |
-55 |
Maximum Operating Temperature (°C) |
125 |
Mating Cycle (Cycles) |
100 |
Maximum Terminal Width (mm) |
0.46(Typ) |
Mounting Styles |
Alignment Pin |
Contact Plating Thickness |
(0.25/1.27)um |
Tail Shape |
Ball |
Mounting Ears |
No |
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PACKAGE INFO
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Terminal Pitch (mm) |
0.635 |
Body Orientation |
Straight |
Mounting |
Surface Mount |
Product Length (mm) |
42.82 |
Product Length (Ejector Open) (mm) |
N/R |
Product Depth (mm) |
5 |
Product Height (mm) |
4.1 |
Length Tolerance (mm) |
±0.13 |
Depth Tolerance (mm) |
±0.13 |
Height Tolerance (mm) |
N/A |
Product Weight (g) |
N/A |
Maximum Product Depth (mm) |
5.13 |
Maximum Product Height (mm) |
N/A |
Maximum Product Length (mm) |
42.95 |
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MANUFACTURING INFO
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MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020E |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Wave Temp. Source |
Link to Datasheet |
Lead Finish(Plating) |
Matte Sn |
Under Plating Material |
Ni |
Terminal Base Material |
Cu Alloy |
Number of Wave Cycles |
N/R |
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PACKAGING INFO |
Packaging Suffix |
TR |
Packaging |
Tape and Reel |
Packaging Document |
Link to Datasheet |
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ECAD MODELS |
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