
|
|
• Amplitude settling: 200 ns typical
|
• Wideband rejection: ≥20 dB
|
• Single chip implementation
|
• 40-lead, 6 mm × 6 mm, RoHS compliant LFCSP
|
|
| CATALOG |
ADMV8416ACPZ COUNTRY OF ORIGIN
|
ADMV8416ACPZ PARAMETRIC INFO
|
ADMV8416ACPZ PACKAGE INFO
|
ADMV8416ACPZ MANUFACTURING INFO
|
ADMV8416ACPZ PACKAGING INFO
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ADMV8416ACPZ ECAD MODELS
|
ADMV8416ACPZ APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Philippines
|
|
PARAMETRIC INFO
|
| Type |
Band Pass Filter |
| Number of Circuits |
1 |
| Cut-Off Frequency Range |
>=6MHz |
| Cut-Off Frequency |
18GHz(Max) |
| Power Supply Type |
Dual |
| Maximum Dual Supply Voltage (V) |
±5.6 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
LFCSP EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
40 |
| Lead Shape |
No Lead |
| PCB |
40 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
6 |
| Package Width (mm) |
6 |
| Package Height (mm) |
0.73 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
6 |
| Package Overall Width (mm) |
6 |
| Package Overall Height (mm) |
0.75 |
| Seated Plane Height (mm) |
0.75 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Lead Frame Chip Scale Package, Exposed Pad |
| Package Family Name |
CSP |
| Jedec |
MO-220WJJD-5 |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
500 |
|
|
ECAD MODELS
|

|
|
APPLICATIONS
|
| • Test and measurement equipment |
| • Military radar and electronic warfare (EW) systems |
| • Video satellite (VSAT) communications |
| |