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• ±15 kV ESD protection on output pins
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• 400 Mbps (200 MHz) switching rates
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• Flow-through pinout simplifies PCB layout
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• 100 ps channel-to-channel skew (typical)
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• 2.5 ns maximum propagation delay
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• 3.3 V power supply
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• High impedance outputs on power-down
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• Low power design: typically 3 mW (quiescent)
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|
| CATALOG |
ADN4664BRZ COUNTRY OF ORIGIN
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ADN4664BRZ PARAMETRIC INFO
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ADN4664BRZ PACKAGE INFO
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ADN4664BRZ MANUFACTURING INFO
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ADN4664BRZ PACKAGING INFO
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ADN4664BRZ ECAD MODELS
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ADN4664BRZ FUNCTIONAL BLOCK DIAGRAM
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ADN4664BRZ APPLICATIONS
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COUNTRY OF ORIGIN
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Taiwan (Province of China)
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|
PARAMETRIC INFO
|
| Function |
Receiver |
| Number of Drivers |
0 |
| Number of Receivers |
2 |
| Input Signal Type |
LVDS |
| Transmission Data Rate (Mbps) |
400 |
| Number of Elements per Chip |
2 |
| Minimum Operating Supply Voltage (V) |
3 |
| Typical Operating Supply Voltage (V) |
3.3 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Maximum Input Current (uA) |
20 |
| Output Signal Type |
CMOS|LVTTL |
| Differential Input High Threshold Voltage (V) |
0.1 |
| Differential Input Low Threshold Voltage (V) |
-0.1 |
| Minimum Operating Frequency (MHz) |
200 |
| Maximum Operating Frequency (MHz) |
250(Typ) |
| Maximum Propagation Delay Time (ns) |
2.5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Process Technology |
CMOS|TTL |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
|
|
PACKAGE INFO
|
| Supplier Package |
SOIC N |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
5(Max) |
| Package Width (mm) |
4(Max) |
| Package Height (mm) |
1.5(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5(Max) |
| Package Overall Width (mm) |
6.2(Max) |
| Package Overall Height (mm) |
1.75(Max) |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC Narrow Body |
| Package Family Name |
SO |
| Jedec |
MS-012AA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging |
Tube |
| Quantity Of Packaging |
98 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
|
FUNCTIONAL BLOCK DIAGRAM
|
|
|
APPLICATIONS
|
• Point-to-point data transmission
|
• Multidrop buses
|
| • Clock distribution networks |
| • Backplane receivers |
| |
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