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• ±15 kV ESD protection on output pins
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• 400 Mbps (200 MHz) switching rates
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• 100 ps typical differential skew
|
• 400 ps maximum differential skew
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• 2 ns maximum propagation delay
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• 3.3 V power supply
|
• Low power dissipation (13 mW typical)
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• Interoperable with existing 5 V LVDS receivers
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• High impedance on LVDS outputs on power-down
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• Conforms to TIA/EIA-644 LVDS standards
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• Industrial operating temperature range: −40°C to +85°C
|
• Available in surface-mount SOIC package and low profile
TSSOP package
|
|
| CATALOG |
ADN4665ARUZ-REEL7 COUNTRY OF ORIGIN
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ADN4665ARUZ-REEL7 PARAMETRIC INFO
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ADN4665ARUZ-REEL7 PACKAGE INFO
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ADN4665ARUZ-REEL7 MANUFACTURING INFO
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ADN4665ARUZ-REEL7 PACKAGING INFO
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ADN4665ARUZ-REEL7 ECAD MODELS
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ADN4665ARUZ-REEL7 FUNCTIONAL BLOCK DIAGRAM
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ADN4665ARUZ-REEL7 APPLICATIONS
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|
COUNTRY OF ORIGIN
|
Philippines
|
|
PARAMETRIC INFO
|
| Function |
Driver |
| Number of Drivers |
4 |
| Number of Receivers |
0 |
| Input Signal Type |
CMOS|TTL |
| Transmission Data Rate (Mbps) |
400 |
| Number of Elements per Chip |
4 |
| Minimum Operating Supply Voltage (V) |
3 |
| Typical Operating Supply Voltage (V) |
3.3 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Output Signal Type |
LVDS |
| Maximum Differential Output Voltage (V) |
0.45 |
| Minimum Operating Frequency (MHz) |
200 |
| Maximum Operating Frequency (MHz) |
250(Typ) |
| Maximum Propagation Delay Time (ns) |
2 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
|
|
PACKAGE INFO
|
| Supplier Package |
TSSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
16 |
| Lead Shape |
Gull-wing |
| PCB |
16 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
5 |
| Package Width (mm) |
4.4 |
| Package Height (mm) |
1.05(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5 |
| Package Overall Width (mm) |
6.4 |
| Package Overall Height (mm) |
1.2(Max) |
| Seated Plane Height (mm) |
1.2(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Thin Shrink Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-153AB |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
10 |
| Number of Reflow Cycle |
N/A |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
REEL7 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1000 |
| Reel Diameter (in) |
7 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
16 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
| Tape Material |
Plastic |
| Tape Type |
Embossed |
|
|
ECAD MODELS
|
|
|
FUNCTIONAL BLOCK DIAGRAM
|
|
|
APPLICATIONS
|
• Backplane data transmission
|
• Cable data transmission
|
• Clock distribution
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