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• Ultracompact SC70 and TSOT packages
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• Low temperature coefficient 8-lead SOIC: 3 ppm/°C typical 5-lead SC70: 9 ppm/°C maximum 5-lead TSOT: 9 ppm/°C maximum
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• Initial accuracy ±0.1%
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• No external capacitor required
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• Low noise 10 µV p-p, 0.1 Hz to 10.0 Hz (ADR02)
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• Wide operating range，ADR01: 12.0 V to 36.0 V，ADR02: 7.0 V to 36.0 V，ADR03: 4.5 V to 36.0 V，ADR06: 5.0 V to 36.0 V
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• High output current 10 mA
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• Wide temperature range: −40°C to +125°C
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• ADR01/ADR02/ADR03 pin compatible to industry-standard REF01/REF02/REF03
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• ADR01, ADR02, ADR03 and ADR06 SOIC (A grade) qualified for automotive applications
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| CATALOG |
| ADR02AUJZ-REEL7 COUNTRY OF ORIGIN |
ADR02AUJZ-REEL7 PARAMETRIC INFO
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ADR02AUJZ-REEL7 PACKAGE INFO
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ADR02AUJZ-REEL7 MANUFACTURING INFO
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ADR02AUJZ-REEL7 PACKAGING INFO
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ADR02AUJZ-REEL7 ECAD MODELS
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ADR02AUJZ-REEL7 APPLICATIONS
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COUNTRY OF ORIGIN
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Philippines
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United States of America
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PARAMETRIC INFO
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| Topology |
Series |
| Reference Type |
Precision |
| Output Voltage (V) |
5 |
| Initial Accuracy |
0.1% |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Supplier Temperature Grade |
Extended Industrial |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
| Load Regulation |
70ppm/mA |
| Line Regulation |
30ppm/V |
| Maximum Input Voltage (V) |
36 |
| Regulation Condition Change In Load |
10mA |
| Maximum Output Current (mA) |
10 |
| Regulation Condition Change In Line |
29V |
| Maximum Temperature Coefficient |
25ppm/°C |
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|
PACKAGE INFO
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| Supplier Package |
TSOT |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
5 |
| Lead Shape |
Gull-wing |
| PCB |
5 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.95 |
| Package Length (mm) |
2.9 |
| Package Width (mm) |
1.6 |
| Package Height (mm) |
0.9(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
2.9 |
| Package Overall Width (mm) |
2.8 |
| Package Overall Height (mm) |
1(Max) |
| Seated Plane Height (mm) |
1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Thin Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
MO-193AB |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging Suffix |
REEL7 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Reel Diameter (in) |
7 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Component Orientation |
Q3 |
| Packaging Document |
Link to Datasheet |
| Tape Material |
Plastic |
| Tape Type |
Embossed |
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ECAD MODELS
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APPLICATIONS
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• Precision data acquisition systems
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• High resolution converters
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• Industrial process control systems
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• Precision instruments
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• Auto battery monitoring
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| • PCMCIA cards |
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