|
|
• Ultracompact SC70 and TSOT packages
|
• Low temperature coefficient
8-lead SOIC: 3 ppm/°C typical
5-lead SC70: 9 ppm/°C maximum
5-lead TSOT: 9 ppm/°C maximum
|
• Initial accuracy ±0.1%
|
• No external capacitor required
|
• Low noise 10 µV p-p, 0.1 Hz to 10.0 Hz (ADR02)
|
| • High output current 10 mA |
| • Wide temperature range: −40°C to +125°C |
| • ADR01/ADR02/ADR03 pin compatible to industrystandard REF01/REF02/REF0 |
| • ADR01, ADR02, ADR03 and ADR06 SOIC (A grade) qualified
for automotive applications |
|
| CATALOG |
ADR06BUJZ-REEL7 COUNTRY OF ORIGIN
|
ADR06BUJZ-REEL7 PARAMETRIC INFO
|
ADR06BUJZ-REEL7 PACKAGE INFO
|
ADR06BUJZ-REEL7 MANUFACTURING INFO
|
ADR06BUJZ-REEL7 PACKAGING INFO
|
ADR06BUJZ-REEL7 ECAD MODELS
|
ADR06BUJZ-REEL7 APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
| Malaysia |
| Philippines |
|
PARAMETRIC INFO
|
| Topology |
Series |
| Reference Type |
Precision |
| Output Voltage (V) |
3 |
| Initial Accuracy |
0.1% |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Supplier Temperature Grade |
Extended Industrial |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
| Load Regulation |
70ppm/mA |
| Line Regulation |
30ppm/V |
| Maximum Input Voltage (V) |
36 |
| Maximum Output Current (mA) |
10 |
| Maximum Temperature Coefficient |
9ppm/°C |
|
|
PACKAGE INFO
|
| Supplier Package |
TSOT |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
5 |
| Lead Shape |
Gull-wing |
| PCB |
5 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.95 |
| Package Length (mm) |
2.9 |
| Package Width (mm) |
1.6 |
| Package Height (mm) |
0.9(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
2.9 |
| Package Overall Width (mm) |
2.8 |
| Package Overall Height (mm) |
1(Max) |
| Seated Plane Height (mm) |
1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Thin Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
MO-193AB |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
REEL7 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Reel Diameter (in) |
7 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
|
APPLICATIONS
|
• Precision data acquisition systems
|
| • High resolution converters
|
• Industrial process control systems
|
• Precision instruments
|
• Auto battery monitoring
|
| • PCMCIA cards |
|
| |
| |
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