|
|
• Initial accuracy
A grade: ±0.70% (maximum)
B grade: ±0.35% (maximum)
|
• Maximum temperature coefficient
A grade: 50 ppm/°C
B grade: 25 ppm/°C
|
• CLOAD = 0.1 μF to 1 μF
|
• Output current: +4 mA/−2 mA
|
• Low operating current: 80 μA (typical)
|
• Output noise: 6 μV p-p at 1.0 V output
|
|
| CATALOG |
| ADR130BUJZ-REEL7 COUNTRY OF ORIGIN |
ADR130BUJZ-REEL7 PARAMETRIC INFO
|
ADR130BUJZ-REEL7 PACKAGE INFO
|
ADR130BUJZ-REEL7 MANUFACTURING INFO
|
ADR130BUJZ-REEL7 PACKAGING INFO
|
ADR130BUJZ-REEL7 ECAD MODELS
|
ADR130BUJZ-REEL7 APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Ireland
|
| Philippines |
|
PARAMETRIC INFO
|
| Topology |
Series |
| Reference Type |
Programmable |
| Output Voltage (V) |
0.5/1 |
| Initial Accuracy |
0.35% |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Supplier Temperature Grade |
Industrial |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
| Load Regulation |
2mV/mA |
| Line Regulation |
40ppm/V |
| Maximum Input Voltage (V) |
20 |
| Regulation Condition Change In Load |
2mA |
| Maximum Output Current (mA) |
4 |
| Regulation Condition Change In Line |
16V |
| Maximum Temperature Coefficient |
25ppm/°C |
|
|
PACKAGE INFO
|
| Supplier Package |
TSOT |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
6 |
| Lead Shape |
Gull-wing |
| PCB |
6 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.95 |
| Package Length (mm) |
2.9 |
| Package Width (mm) |
1.6 |
| Package Height (mm) |
0.87 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
2.9 |
| Package Overall Width (mm) |
2.8 |
| Package Overall Height (mm) |
1(Max) |
| Seated Plane Height (mm) |
1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Thin Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
MO-193AA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
REEL7 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Reel Diameter (in) |
7 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Component Orientation |
Q4 |
| Packaging Document |
Link to Datasheet |
| Tape Material |
Plastic |
| Tape Type |
Embossed |
|
|
ECAD MODELS
|
|
|
APPLICATIONS
|
• Battery-powered instrumentation
|
| • Portable medical equipment |
| • Communication infrastructure equipment |
| |
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